Samsung Electronics Co., Ltd.

Sang-Pil Sim

Hee-Soo Kang

Soo-Hun Hong

Shigenobu Maeda

Hyun-Jo Kim

Chan-Kwang Park

Hee-Don Jung

Chang-Hyun Lee

Ki-Nam Kim

Soon-Moon Jung

Jung-Ho Do

Seung-Keun Lee

Kwang-soo Kim

Chul-hong Park

Sung-Bong Kim

Chang-Wook Moon

Dong-hun Lee

Su-Youn Yi

Hyung-Soon Jang

Hyun-jong Lee

Wook-Hyun Kwon

Soo-Han Choi

Wook-hyun Kwon

Dong-Kyun Sohn

Si-Woo Lee

Heon-Kyu Lee

Se-Chan Lim

Won Seong Lee

Jin Yang Kim

A semiconductor device can include a field insulation layer including a planar major surface extending in first and second orthogonal directions and a protruding portion that protrudes a particular distance from the major surface relative to the first and second orthogonal directions. First and second multi-channel active fins can extend on the field insulation layer, and can be separated from one another by the protruding portion. A conductive layer can extend from an uppermost surface of the protruding portion to cross over the protruding portion between the first and second multi-channel active fins.

Semiconductor devices including protruding insulation portions between active fins

A semiconductor device includes a substrate including first to third fins aligned in a first direction, a first trench arranged between the first fin and the second fin, and a second trench arranged between the second fin and the third fin. The semiconductor device further includes a first field insulating film arranged in the first trench, a second field insulating film formed in the second trench, a first dummy gate arranged on the first field insulating film and a second dummy gate at least partly arranged on the second field insulating film. A lower surface of the second field insulating film is arranged to be lower than a lower surface of the first field insulating film.

Semiconductor devices having 3D channels, and methods of fabricating semiconductor devices having 3D channels

Semiconductor devices are provided. The semiconductor devices include a first fin; a first gate electrode intersecting the first fin; a first elevated source and/or drain on respective sides of the first gate electrode on the first fin; and a first field dielectric film adjacent the first fin. The first field dielectric film includes a first part below a top surface of the first fin and a second part protruding from the first part and above a top surface of the first fin that makes contact with the first elevated source and/or drain.

Semiconductor devices having fin shaped channels

A semiconductor device including source drain stressors is provided. The semiconductor device includes a gate structure including a gate insulating layer and a gate electrode on a semiconductor substrate. Gate spacers may be disposed on sidewalls of the gate structure and a stressor pattern including an impurity region is disposed on a side of the gate structure. The stressor pattern includes a protruded portion having a top surface higher than a bottom surface of the gate structure and a facet in the protruded portion. The facet is slanted at a predetermined angle with respect to an upper surface of the semiconductor substrate and forms a concave portion with one of the gate spacers. A blocking insulating layer may extend conformally on the stressor pattern and the gate spacers and an insulating wing pattern is disposed in the concave portion on the blocking insulating layer.

Semiconductor devices including raised source/drain stressors and methods of manufacturing the same

A semiconductor device includes a substrate including first to third fins aligned in a first direction, a first trench arranged between the first fin and the second fin, and a second trench arranged between the second fin and the third fin. The semiconductor device further includes a first field insulating film arranged in the first trench, a second field insulating film formed in the second trench, a first dummy gate arranged on the first field insulating film, and a second dummy gate at least partly arranged on the second field insulating film. A lower surface of the second field insulating film is arranged to be lower than a lower surface of the first field insulating film.

A method of forming a pattern includes defining a plurality of patterns, defining a plurality of pitch violating patterns that contact the plurality of patterns and correspond to regions between the patterns, classifying the plurality of pitch violating patterns into a first region and a second region that is adjacent to the first region, selecting one of the first region and the second region, and forming an initial pattern defined as the selected first or second region. The selecting includes performing at least one of i) selecting a region that contact dummy patterns, ii) selecting a region of a same kind as one region, and iii) selecting a region that contacts a concave part of an enclosure from the first region and the second region.

Method of forming a pattern

A semiconductor device includes a substrate having first, second and third fins longitudinally aligned in a first direction. A first trench extends between the first and second fins, and a second trench extends between the second and third fins. A first portion of field insulating material is disposed in the first trench, and a second portion of field insulating material is disposed in the second trench. An upper surface of the second portion of the field insulating material is recessed in the second trench at a level below uppermost surfaces of the second and third fins. A first dummy gate is disposed on an upper surface of the first portion of the field insulating material, and a second dummy gate at least partially extends into the second trench to the upper surface of the second portion of the field insulating material.

Semiconductor device having 3D channels, and methods of fabricating semiconductor devices having 3D channels

A method of programming a plurality of memory cells in a flash memory device from a first state to a second state includes verifying the plurality of memory cells using a verify voltage having a level increased according to an increase in a program loop number; and programming the plurality of memory cells using a program voltage having an increment decreased according to an increase in the program loop number, wherein the verifying and programming steps constitute a program loop, the program loop being terminated at a point in time when a level of the verify voltage reaches to a voltage range of the second state.

Flash memory device and program method thereof

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Seongnam-si, South Korea

Sang-Pil Sim