Samsung Electronics Co., Ltd.

Samsung Electro-mechanics Co., Ltd.

Yonsei University

Sang Mock Lee

Eun Sung Lee

Sang Soo Jee

Se Yun Kim

Yoon Chul Son

Hyeon Cheol Park

Chan Kwak

Kwang Hee Kim

Kyu Hyoung Lee

Kun Mo Chu

Byungki Ryu

Myung Sup Jung

Chung Kun Cho

Kalinina Fedosya

Young Hun Byun

In Taek Han

Young Hwan Kim

Kimoon Lee

Jingyu Lee

Suk Jun Kim

Kovalev Mikhail

Do-hyang Kim

Jin Man Park

Jin Young Bae

Ka Ram Lim

In Yong Song

According to example embodiments, a transparent electrically conductive film including a compound that has a two-dimensional electron gas layer, and has a product of an absorption coefficient (&#x3b1;) for light having a wavelength of about 550 nm at 25&#xb0; C. and a resistivity value (&#x3c1;) thereof of less than or equal to about 30 &#x3a9;/sq is provided. The electrically conductive film may be a layered crystal structure of the compound.

Electrically conductive thin films

A transparent conductive thin film and an electronic device including the same are disclosed, the transparent conductive thin film including a titanium nitride or a zirconium nitride having a heterometal element selected from zinc (Zn), gallium (Ga), indium (In), and a combination thereof.

Transparent conductive thin film

Disclosed are a composite transparent electrode, a production method thereof, and an electronic device including the same, wherein the composite transparent electrode includes a metal nitride thin film including at least one of indium (In), titanium (Ti), zinc (Zn), zirconium (Zr), and gallium (Ga), and a metal oxide thin film including at least one of indium (In), zinc (Zn), tin (Sn), and titanium (Ti), the metal oxide thin film being formed on one surface or opposite surfaces of the metal nitride thin film.

Composite transparent electrodes

Disclosed are a heat dissipation material comprising a metallic glass and an organic vehicle and a light emitting diode package including at least one of a junction part, wherein the junction part includes a heat dissipation material including a metallic glass.

Heat dissipation material and light emitting diode package including a junction part made of the heat dissipation material

A hafnium telluride compound includes a layered crystal structure and represented by the following Chemical Formula 1.HfTeA&#x2003;&#x2003;[Chemical Formula 1] Herein, A is at least one selected from phosphorus (P), Arsenic (As), antimony (Sb), bismuth (Bi), sulfur (S) and selenium (Se), and 0&#x3c;x&#x2266;1.

Hafnium telluride layered compounds, transparent and electrically conductive film, and electronic devices including the same

A sealing material includes a metallic glass.

Sealing material, display device, and method of manufacturing the display device

A conductive paste may include a conductive powder, a metallic glass including a first element having a heat of mixing value with the conductive powder of less than 0, and an organic vehicle, and an electronic device and a solar cell may include an electrode formed using the conductive paste.

Conductive paste and electronic device and solar cell including an electrode formed using the same

A polyamide block copolymer that includes a first segment including a repeating unit represented by Chemical Formula 1, a repeating unit represented by Chemical Formula 2, or a combination thereof; and a second segment including a repeating unit represented by Chemical Formula 3. The variables Rto R, and n1 to n8 are defined herein. 

Polyamide block copolymer, article including same, and display device including the article

A photosensitive polyimide composition, a polyimide film, and a semiconductor device using the same are disclosed. The photosensitive polyimide composition can be cured by heating. A polyhydroxyimide is used as a base resin and can be mixed with a photoacid generator and a cross-linking agent having two or more vinylether groups. A film of the photosensitive polyimide composition can be developed by treatment with an alkaline aqueous solution. Embodiments of the invention enable improvement in production yield and reliability in a highly-integrated memory semiconductor packaging processes.

Photosensitive polyimide composition, polyimide film and semiconductor device using the same

Disclosed is a polymeric surfactant for high dielectric polymer composites, a method of preparing the same, and a high dielectric polymer composite including the same. The polymeric surfactant for high dielectric polymer composites, which includes a head portion having high affinity for a conductive material and a tail portion having high affinity for a polymer resin, forms a passivation layer surrounding the conductive material in the high dielectric polymer composite including the polymeric surfactant, thus ensuring and controlling a high dielectric constant.

Growing community of inventors

Yongin-si, South Korea

Sang Mock Lee