Lg Chem, Ltd

Sang Kyu Kwak

Keon Woo Lee

Chang Soon Lee

Sung Hyun Kim

Dong Kung Oh

Chang Ho Cho

Hyehyeon Kim

Changsoon Lee

Raisa Kharbash

Kyoung Hoon Min

Seung Hee Lee

Chang Hyun Cho

Saehee Kim

Bog Ki Hong

Yong Sik Ahn

Won Jin Chung

Beom Su Park

Jong Hwi Hwang

Hye Hyeon Kim

Dong Seok Kim

The present invention relates to a photosensitive composition including an acrylate-based compound having an adamantyl structure. It is possible to manufacture an organic thin film that is easily stripped without decreasing the strength of the thin film by using the photosensitive composition.

Photosensitive composition comprising an acrylate compound

The present application relates to a novel compound, a photosensitive composition comprising the same and a photosensitive material.

Compound, photosensitive composition comprising the same and photosensitive material

The present application relates to a siloxane-based compound, a photosensitive composition including the same, and a photosensitive material.

Siloxane-based compound, photosensitive composition comprising the same and photosensitive material

The present invention relates to an acrylate-based compound that includes an organic acid having two or more acrylate groups and one or more phenolic acid structures in one molecule, and a photosensitive composition including the same. It is possible to shorten a developing time in a photolithography process without damaging photosensitivity by using the photosensitive composition according to the present invention.

Acrylate-based compounds and photosensitive composition comprising the same

A novel alkali-soluble polymer compound including a dehydrogenated pimaric acid and/or its isomer as a repeating unit, and a photosensitive resin composition including the alkali-soluble polymer compound as an effective binder matrix are provided. A photosensitive resin composition using the alkali-soluble polymer compound including a dehydrogenated resin acid has excellent photosensitivity and developing characteristics cause a less deformation in a firing process, has excellent elasticity. Thus, the photosensitive resin composition is advantageous for curing various transparent photosensitive materials, in particular, materials of column spacers, an overcoat, a passivation layer, or the like, used for fabricating color filters of an LCD.

Alkali-soluble polymer compound and photosensitive resin composition using the same

A photoresist composition is provided. The photoresist composition comprises two or more kinds of photoinitiators having different activation wavelengths whose difference is at least 20 nm. The photoresist composition has high sensitivity and forms a pattern whose thickness is easy to control depending on the exposure intensity through a slit or transflective mask. Further provided are a transparent thin film formed using the photoresist composition and a liquid crystal display device comprising the thin film.

Photoresist composition comprising photoinitiators, and transparent thin film and liquid crystal display device using the composition

A composition for forming column spacers is provided. The composition comprises a radical polymerization inhibitor. The use of the composition enables simultaneous formation of a saturated pattern and a semi-transmissive pattern as column spacer patterns having different shapes, whose difference in thickness is controllable as desired although the sensitivity is slightly reduced, through a slit or semi-transmissive mask by varying the kind and amount of the radical polymerization inhibitor. Further provided are column spacers formed using composition and a liquid crystal display using the column spacers.

Composition for simultaneously forming two isolated column spacer patterns

A color filter substrate is provided. In the color filter substrate, transparent protective films are formed on respective sub-pixels of a color filter. The color filter substrate has improved electric field characteristics without the need for additional optical or circuit compensation to achieve an improvement in contrast and a reduction in color difference.

Color filter substrate

A novel photoactive compound is provided. The photoactive compound has a structure represented by Formula 1:  The photoactive compound efficiently absorbs UV light. Accordingly, the photoactive compound has an improved ability to generate radicals and is efficiently photopolymerized with unsaturated bonds. Further provided is a photosensitive resin composition comprising the photoactive compound. The photosensitive resin composition has good sensitivity because it efficiently absorbs UV light. In addition, the photosensitive resin composition has excellent characteristics in terms of residual film ratio, mechanical strength and resistance to heat, chemicals and development. Therefore, the photosensitive resin composition is advantageously used in curing materials for column spacers, overcoats and passivation films of liquid crystal display devices. In addition, the photosensitive resin composition has excellent thermal processing characteristics.

Photoactive compound and photosensitive resin composition comprising the same

A photopolymerization initiator is provided. The photopolymerization initiator contains at least one unsaturated double bond and at least one oxime ester group in the molecule. The photopolymerization initiator comprises a compound represented by Formula 1 or 2:   Further provided is a photosensitive resin composition comprising the photopolymerization initiator. The use of the photosensitive resin composition in photolithography reduces the formation of volatile residue during post-development baking.

Photopolymerization initiator containing unsaturated double bond and oxime ester group and photosensitive resin composition comprising the same

The present invention relates to a photoactive compound of a novel structure represented by Chemical Formula 1 below In Chemical Formula 1, Rand R, R, and A are as defined in the specification, and a photosensitive resin composition comprising the same. The photoactive compound of the present invention comprises a nitro group and a phosphonate structure and thus exhibits excellent sensitivity through efficient absorption for UV light, excellent compatibility between the photoactive compound and the alkali-soluble binder resin, and an improved solubility of the photosensitive resin composition. Furthermore, the photosensitive resin composition of the present invention has excellent residual film thickness and mechanical strength characteristics and heat-resistant, chemical-resistant, and development-resistant properties. Accordingly, the photosensitive resin composition of the present invention is advantageous in hardening the column spacers of liquid crystal displays, an overcoat, and passivation materials and also advantageous in a high-temperature process characteristic.

Photoactive compound and photosensitive resin composition containing the same

This invention provides a thermally curable resin copolymer (A), composed mainly of an ethylenically unsaturated monomer (a-1), which produces an acid via decomposition at 150&#xb0; C. or more, an ethylenically unsaturated monomer (a-2) containing an epoxy group copolymerizable with the ethylenically unsaturated monomer (a-1), and an ethylenically unsaturated monomer (a-3) having a reactive silyl group; a thermally curable resin composition including the thermally curable resin copolymer; a cured film formed from the composition; and a liquid crystal display including the cured film. The thermally curable resin composition has extended storage stability and can be formed into the cured film having good adhesion to a substrate.

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Daejeon, South Korea

Sang Kyu Kwak