Samsung Electronics Co., Ltd.

Lg Innotek Co., Ltd.

Sang Ki Cho

Ki Jun Kim

Chang Heon Lee

Dae Dong Kim

Jun Young Lim

Moon Sun Shin

Ki Tae Park

Dae Sung Yoo

Han Mo Koo

Tae Ki Hong

Young Lae Jo

Jae Sung Jo

Nak Ho Song

Joo Chul Kim

Dong Guk Jo

Jun Sik Hwang

Jee Heum Paik

Bu Youn Lee

Do-Hoon Kim

Jung Won Kim

Hyeong Kyu Cho

Min Gu Jeon

Keun Jeong Jang

Jong Moon Lee

Se Woong Youn

Se Joo Na

Young Lae Lo

An air conditioner includes a discharge blade configured to move between a guide position at which a direction of air blown from a blower fan and discharged to an outlet is controlled, and a closing position at which the outlet is closed, wherein the discharge blade includes a plurality of blade holes through which the air is discharged through the discharge blade at the closing position, wherein the discharge blade moves between the guide position and the closing position and controls an air flow from the blower fan to a discharge plate or the outlet. Through this configuration, an air flow discharged to the outside of the housing can be controlled by operation of the discharge blade.

Air conditioner

Disclosed is an air conditioner to prevent deterioration of cooling or heating performance caused by re-introduction of cooling or heating air into a heat exchanger. The air conditioner includes a housing including an air discharge plate having a plurality of holes and an outlet, a heat exchanger located inside the housing, a blower fan configured to blow air heat-exchanged with the heat exchanger toward the air discharge plate or the outlet, a blade rotating between a guide position to guide a direction of air blown from the blower fan and discharged through the outlet and a closing position to close the outlet, wherein the blade includes a first blade and a second blade spaced apart from the first blade and configured to guide air blown from the blower fan toward the air discharge plate when the first blade is located at the closing position.

An air conditioner includes a heat exchanger configured to exchange heat with air introduced into a housing and a blowing fan configured to blow the air which is heat-exchanged with the heat exchanger to outside of the housing. The air conditioner may control a first and a second doors configured to open or close a first and second blowing ports provided in the housing and a guide blade configured to control paths in the housing, so that the air conditioner may blow the air of various flow.

The present invention relates to a method of manufacturing a carrier tape, wherein a TAB tape including a base film having a central area and edge areas at both directions of the central area, a wiring pattern formed at the central area of the base film, a transfer area formed at the edge area of the base film and exposed by the base film, a plurality of sprocket holes arranged in a row on the transfer area and a metal pattern discretely formed from the wiring pattern, and formed at the edge areas of the base film, wherein the metal pattern is formed with a paired structure formed at both sides of the plurality of sprocket holes, such that the present invention has an advantageous effect in that no Cu layer or a metal layer exists at a portion of the sprocket holes from which friction is generated by a driving roller during assembly work between a drive IC and chips/drive IC and panel to dispense with generation of foreign objects such as Cu particles, thereby enhancing reliability of the product.

Method of manufacturing a carrier tape

The present invention relates to a method for manufacturing a TAB tap. The method includes forming a circuit pattern region having input/output terminal pattern on a base film, and forming an exposing region at a convey region having a sprocket hole for exposing the base film. Accordingly, the present invention provides a TAB tape that improves reliability of a product by fundamentally preventing the generation of metal particles by forming exposing regions that expose a base film through selectively etching and removing a metal layer of a convey region formed at both side of a TAB tape and having a sprocket hole, and that prevents short-circuit by partially removing a base film at a predetermined region not having a circuit pattern formed thereon through etching.

Carrier tape for tab-package and manufacturing method thereof

Provided are an optical device package and a method of manufacturing the same. The method of manufacturing the optical device package according to an exemplary embodiment of the present invention comprises: forming a metal layer on an insulating layer on which via holes are formed; forming a circuit pattern layer by etching the metal layer; forming a boundary part in a predetermined part of the metal layer; mounting an optical device on the circuit pattern layer; and forming a molding part by applying a transparent material to the optical device, wherein the predetermined part is a part corresponding to a boundary of the molding part.

Optical device package having a groove in the metal layer

The present invention relates to a carrier tape for TAB-package and a manufacturing method thereof, wherein a TAB tape including a base film having a central area and edge areas at both directions of the central area, a wiring pattern formed at the central area of the base film, a transfer area formed at the edge area of the base film and exposed by the base film, a plurality of sprocket holes arranged in a row on the transfer area and a metal pattern discretely formed from the wiring pattern, and formed at the edge areas of the base film, wherein the metal pattern is formed with a paired structure formed at both sides of the plurality of sprocket holes, such that the present invention has an advantageous effect in that no Cu layer or a metal layer exists at a portion of the sprocket holes from which friction is generated by a driving roller during assembly work between a drive IC and chips/drive IC and panel to dispense with generation of foreign objects such as Cu particles, thereby enhancing reliability of the product.

The present invention relates to a carrier tape for TAB-package and a manufacturing method thereof, wherein a TAB tape including a wiring pattern and a metal plating layer formed on a base film comprises a transfer area including a row of sprocket holes arranged along the edges of the base film at predetermined intervals, and wherein the transfer area includes an exposure area from which the base film is exposed, such that the present invention has an advantageous effect in that no Cu layer or a metal layer exists at a portion of the sprocket holes from which friction is generated by a driving roller during assembly work between a drive IC and chips/drive IC and panel to dispense with generation of foreign objects such as Cu particles, thereby enhancing reliability of the product.

Growing community of inventors

Seoul, South Korea

Sang Ki Cho