Samsung Display Co., Ltd.

Az Electronic Materials (korea) Ltd.

Samsung Electronics Co., Ltd.

Samsung Displayco., Ltd.

Az Electronic Materials (japan) K.k.

Sang-Hyun Yun

Hi-Kuk Lee

Jung-In Park

Cha-Dong Kim

Ki-beom Lee

Hyun-Seok Kim

Jae-Hyuk Chang

Chang-Hoon Kim

Jun-Ho Sim

Sang-Hyun Lee

Kab-Jong Seo

Jung-Chul Heo

Su-Yeon Sim

Deok-Man Kang

Sae-Tae Oh

Jae-young Choi

Min-Soo Lee

Sang-Woo Bae

Hoon Jong Kang

Ki-Yong Lee

Dong-Hyun Lee

Jin-Wook Seo

Byoung-Keon Park

Yun-Mo Chung

Tae-Hoon Yang

Dong-Min Kim

Jong-Ryuk Park

Kil-Won Lee

Jong-Won Hong

Bo-Kyung Choi

Heung-Yeol Na

Byung-Uk Kim

Min-Jae Jeong

Woo-Seok Jeon

Seok-Rak Chang

Young-Dae Kim

Jae-Wan Jung

Woo-Yong Sung

Ji-Su Ahn

Eu-Gene Kang

Jae-Young Jang

Sang-Don Jang

Seung-Ki Kim

Byoung-Min Yun

Ja-Hun Byeon

Youn-Suk Kim

Jong-Joo Kim

A maskless exposure device includes an exposure head that includes a digital micro-mirror device configured to reflect a source beam received from an exposure source to a substrate to scan an exposure beam to the substrate, and a system control part configured to control the digital micro-mirror device using a graphic data system file. The graphic data system file includes data of an align-key. The align-key includes an X-align-key that extends in a direction parallel to a scan direction of the exposure head, and has a bar shape in a plan view, and a Y-align-key disposed adjacent to the X-align-key that has a frame shape in a plan view.

Maskless exposure device, maskless exposure method and display substrate manufactured by the maskless exposure device and the maskless exposure method

A maskless exposure device includes a stage on which a substrate is disposed, an optical head, and an optical source part. The optical head irradiates light to the substrate. The light source part provides the optical head with a light. The optical head irradiates the light, according to an average-focus distance, to the substrate. The average-focus distance is determined by averaging best-focus distances for a plurality of regions of the substrate, respectively.

Maskless exposure method and a maskless exposure device for performing the exposure method

A maskless exposure device includes an exposure head including a digital micro-mirror device and an exposure source, the digital micro-mirror device being configured to reflect a source beam outputted from the exposure source to a substrate and a system controller configured to control the digital micro-mirror device by using a graphic data system file. The graphic data system file includes data regarding patterns to be formed on the substrate. A pattern extending in a direction parallel to a scan direction of the exposure head includes a first pattern portion having a first width that is greater than a target width and a second pattern portion alternately disposed with the first pattern portion and having a second width that is less than the target width.

A maskless exposure device includes an exposure head including a digital micro-mirror device, the digital micro-mirror device being configured to scan an exposure beam to a substrate by reflecting a source beam from an exposure source; and a system control part configured to control the digital micro-mirror device by utilizing a graphic data system file. The graphic data system file includes data for a source electrode, a drain electrode and a channel portion between the source electrode and the drain electrode in a plan view. The channel portion includes a first portion extending in a direction perpendicular to a scan direction of the exposure head. A width of the first portion of the channel portion is defined to be a multiple of a pulse event generation of the exposure beam.

An exposure apparatus includes a light source, an illuminating member, a projecting member, a stage, an inspecting member, and an information processing member. The light source is configured to provide a light in accordance with a pulse event generation (PEG) representing a period of light radiation. The illuminating member is configured to change the light into point lights. The projecting member is configured to project the point lights according to a photoresist shape extending in various directions. The point lights are projected on the stage. The inspecting member is configured to inspect a photoresist pattern formed by the projected point lights. The information processing member is configured to analyze different photoresist patterns corresponding to different PEGs to select one PEG from the different PEGs. The one PEG being associated with a minimum error in the various directions.

Exposure apparatus and method thereof

A maskless exposure device includes an exposure head including a digital micro-mirror device. The digital micro-mirror device is configured to transmit a source beam applied from an exposure source to a substrate. A system control part is configured to control the digital micro-mirror device by using a graphic data system file. The graphic data system file includes data for forming a source electrode, a drain electrode and a channel portion disposed between the source electrode and the drain electrode. The graphic system file includes data for forming the channel portion extending in a diagonal direction with respect to a scan direction of the exposure head.

A photosensitive resin composition includes an acid-labile resin of about 5 wt % to about 25 wt %, a monomer of about 5 wt % to about 10 wt %, a photoacid generator of about 5 wt % to about 10 wt %, a photoreaction accelerator of about 1 wt % to about 5 wt %, and a solvent of about 50 wt % to about 84 wt %, wherein the acid-labile resin comprises a repeating unit containing an acid group, and a protecting group configured to protect the repeating unit.

Photosensitive resin composition, method for manufacturing organic layer using the composition, and display device comprising the organic layer

A digital exposure apparatus includes a displaceable stage, a light source part, a digital micro mirror part and a micro lens part. A substrate is disposed on the stage. The light source part generates a first light. The digital micro mirror part is disposed over the stage. The digital micro mirror part includes a plurality of digital micro mirrors. The digital micro mirror converts the first light into one or more second light beams. The micro lens part is disposed between the stage and the digital micro mirror part and includes a plurality of micro lenses. The micro lenses convert the one or more second light beams into one or more third light beams which are irradiated upon the substrate. The third light has an oval cross sectional shape.

Digital exposure apparatus and method of exposing a substrate using the same

An exposure system includes an exposure apparatus, a mask, a test pattern portion and a uniformity measuring part. The exposure apparatus includes a first module and a second module. The first and second modules each emit light and are overlapped in an overlapping area. The mask includes a plurality of transmission portions which are spaced apart from each other. Each of the transmission portions has a width less than a width of the overlapping area. The test pattern portion includes a plurality of test patterns which are patterned by using the light transmitted through the transmission portions of the mask. The uniformity measuring part measures a uniformity of the test patterns.

Method of measuring uniformity of exposing light and exposure system for performing the same

A method of forming a photosensitive pattern on a substrate with a photosensitive layer disposed thereon may include moving at least one of the substrate and a set of micro-mirrors in a first direction, the set of micro-mirrors being disposed above the substrate and being arranged as an array, the array having a first edge extending in a second direction, the second direction being at an acute angle with respect to the first direction. The method may also include selectively turning on one or more micro-mirrors of the set of micro-mirrors according to a position of the set of micro-mirrors relative to the photosensitive layer, thereby irradiating one or more spot beams on the photosensitive layer. The photosensitive layer exposed by the spot beams is developed to form a photosensitive pattern having an edge portion extending in a third direction crossing the first and second directions.

Method of forming a photosensitive pattern, method of manufacturing a display substrate, and display substrate

A photoresist composition includes a binder resin, a photo acid generator, an acryl resin having four different types of monomers, and a solvent.

Photoresist composition and method of manufacturing array substrate using the same

The present invention relates to a photoresist composition for digital exposure and a method of fabricating a thin film transistor substrate. The photoresist composition for digital exposure includes a binder resin including a novolak resin and a compound represented by the chemical formula (1), a photosensitizer including a diazide-based compound, and a solvent: 

Photoresist composition and method of fabricating thin film transistor substrate

A photoresist composition is provided. The photoresist composition includes an alkali-soluble resin; a photosensitizer containing a first compound that contains a diazonaphthoquinone represented by Formula 1 and a second compound that contains a diazonaphthoquinone represented by Formula 2; and a solvent. andR1 is selected from the group consisting of a hydrogen atom, an alkyl group having 1 to 4 carbons, an alkenyl group having 2 to 4 carbons, a cycloalkyl group having 3 to 8 carbons, and an aryl group having 6 to 12 carbons, and R2 is selected from the group consisting of Cl, F, Br, and I.

Photoresist composition and method of forming pattern by using the same

An apparatus and a method for determining an overlap distance of an optical head is disclosed. Positions and light amount distributions of each light spot can be measured, which may be provided from an optical head to a substrate. Gaussian distribution may be applied to the positions and the light amount distributions to calculate a compensation model of each of the light spots. A first accumulated light amount corresponding to each first area of the substrate may be calculated if the optical head is scanning along a first direction of the substrate using the compensation model. A second accumulated light amount corresponding to each second area overlapped with the each first area is calculated if the optical head is scanning along the first direction, which is moved in a second direction by a first distance using the compensation model. An overlap distance may be determined based on a uniformity of summations of the first and second accumulated light amount.

Method of determining an overlap distance of an optical head and digital exposure device using the method

An approach for patterning and etching without a mask is provided in a manufacturing a thin-film transistor, a gate electrode, a gate insulating layer, a semiconductor layer, an ohmic contact layer and source metal layer of a substrate. A first photoresist pattern including a first photo pattern and a second photo pattern is formed using a digital exposure device by generating a plurality of spot beams, the first photo pattern is formed to a first region of the base substrate and has a first thickness, and the second photo pattern is formed to a second region adjacent to the first region, and has a second thickness and a width in a range of about 50% to about 60% of a diameter of the spot beam. The source metal layer is patterned to form a source electrode and a drain electrode, and the source electrode and the drain electrode are spaced apart from each other in the first region of an active pattern.

Method of manufacturing a thin-film transistor and method of manufacturing a display substrate using the same

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Suwon-si, South Korea

Sang-Hyun Yun