Semes Co., Ltd.

Sang Hyun Son

Yong-Jun Seo

Sang Min Ha

Dong Ok Ahn

Young Seop Choi

Jae Hong Kim

Sun Yong Park

Hyeong Jun Cho

Yong Jun Seo

Sang Min Lee

Jong Min Lee

Su Jin Chae

Young Ho Park

Kwang Sup Kim

Ji Hoon Yoo

Jae Myoung Lee

Jun Ho Oh

Myeong Jun Lim

Yeon Chul Song

Jong Hyeon Woo

Ji Su Hong

Ji Young Lee

Jun Gwon Lee

Young-Joo Seo

Myung Hwan Eom

Young Joo Seo

Hak Hyon Kim

Hwan Bin Kim

Gyeong Ryul Kim

Joong Chol Shin

The inventive concept provides a teaching method for teaching a transfer position of a transfer robot. The teaching method includes: searching for an object on which a target object to be transferred by the transfer robot is placed, based on a 3D position information acquired by a first sensor; and acquiring coordinates of a second direction and coordinates of a third direction of the object based on a data acquired from a second sensor which is a different type from the first sensor.

Teaching method, program stored in the medium for executing the teaching method and transfer system

A temperature measuring apparatus with improved accuracy is provided. The temperature measuring apparatus comprises a test substrate having a thermal conductivity, a circuit board layer laminated on the test substrate and including a plurality of through holes exposing a top surface of the test substrate, bonding agent disposed in the plurality of through holes and having a thermal conductivity, and a plurality of sensors disposed on the bonding agent and for measuring a temperature.

Apparatus for temperature measurement and method of processing substrate

Disclosed is a substrate processing device which includes a substrate transfer part on which a transfer object is received and a jetting system part includes an ink jet body that jets and prints ink on the transfer object over an upper surface of the substrate transfer part, an ink module transfer part that transfers the ink jet body, an encoder disposed around the ink module transfer part to output a movement signal per unit movement distance of the ink module transfer part, an ink ejection controller that interworks with the ink jet body to control an ink jetting timing of the ink jet body, and a signal splitter that interworks with the encoder to count the movement signal, reset a width of the counted movement signal, and transmit the movement signal, the width of which is reset, to the ink ejection controller.

Substrate processing device and control method for substrate processing device

A flow rate control apparatus with improved reliability is provided. The flow rate control apparatus comprises a flow rate measuring unit for measuring a flow rate of chemical solution in a chemical solution supply line, a flow rate control unit for comparing a preset target flow rate profile and an applied flow rate profile, and controlling the flow rate of the chemical solution so that the applied flow rate profile matches the target flow rate profile, and a processor for switching the flow rate control unit to a first mode in response to a signal for the flow rate of the chemical solution measured by the flow rate measuring unit being less than a preset level, wherein, in the first mode, the applied flow rate profile includes a profile of a flow rate estimation model simulated using a flow rate of chemical solution measured by the flow rate measuring unit.

Apparatus for controlling flow rate and method of controlling flow rate

A substrate type sensor includes a substrate shape member, a pressure sensor panel provided at the substrate shape member, the pressure sensor panel including a plurality of pressure sensors, a central module including a transmission unit, the reception unit receiving data from the pressure sensor panel, and a battery proving power to the pressure sensor panel and the central module.

Substrate type sensor and method of measuring the impact point and the impact force of chemical

A substrate type sensor provided in an atmosphere accompanied by a temperature change to measure a horizontality of a support member that supports a substrate is disclosed. The substrate type sensor may include a base having a shape of the substrate, one or more sensors provided in the base and including 3 or more axis acceleration sensors or 6 or more axis measurement units (IMUs), a receiver configured to receive data collected by the one or more sensors and a power source configured to provide electric power to the one or more sensors and the receiver.

Substrate type sensor for measuring horizontality of substrate support member provided in atmosphere accompanied by temperature change, method for measuring horizontality of substrate support member by using the same, and non-transitory computer readable medium

A buffer unit for temporarily storing a substrate includes a housing having a space for storing a substrate therein, one or more slots disposed within the housing for placing a substrate thereon, and a holding unit disposed at a bottom portion of the housing, having a flat and non-inclined top surface, and comprising a built-in wireless charging module. A substrate type sensor is stored at the holding unit.

Buffer unit and method for storaging substrate type sensor for measuring of horizontality of a substrate support member provided on a temperature varying atmosphere

Provided is a jetting driver that can be used for various types of heads with minimal changes. The jetting driver includes: an image board receiving raw image data and generating image data by transforming the raw image data into a form suitable for a type of heads used; and an interface board physically separated from the image board, receiving the image data, and transmitting the image data to the heads through a plurality of channels.

Jetting driver and substrate treatment apparatus and method

Disclosed is an apparatus for precisely monitoring warpage deformation of a substrate. The apparatus includes a sensing unit and a processor. The sensing unit is removably mounted on the substrate and detects information on the warpage deformation of the substrate during a treatment process performed on the substrate. The processor generates warpage state information on the basis of the warpage information detected by the sensing unit.

Apparatus for and method of monitoring warpage of substrate, substrate treatment apparatus, and substrate-type sensor

The inventive concept provides a wafer type sensor unit which acquires data on a wind direction and a wind velocity of an air flow during processing, the wafer type sensor unit supported by a supporting unit of a substrate processing apparatus. The unit comprising a wafer-shaped circuit board and a hot-wired wind velocity sensor placed apart from an upper surface of the circuit board.

Wafer type sensor unit and data acquisition method using the wafer type sensor unit

Combination desk bed

Storage crate

Lamp shade

Growing community of inventors

Busan, South Korea

Sang Hyun Son