Samsung Electro-mechanics Co., Ltd.

Samsung Electronics Co., Ltd.

Sang Hyun Kwon

Seong Chan Park

Hye Lee Kim

Ae Rim Kim

Hae Sung Oh

Han Bit Kim

Hyung Kyu Kim

Choon Keun Lee

Seung On Kang

Sang Ah Kim

Sang Hyeon Hong

Young Mi Lee

Jin Hee Hwang

A lens includes an optical portion; and a rib portion extending to an external side of the optical portion in a radial direction and including a light transmitting region and a light-shielding region, wherein the light-shielding region includes an ester-based compound and a hydrocarbon-based compound, and wherein the hydrocarbon-based compound includes a saturated hydrocarbon compound.

Lens and lens assembly including the same

A lens includes a light-transmitting portion and a light-shielding portion adjacent to at least a portion of the light-transmitting portion and integrated with the light-transmitting portion. The light-shielding portion includes at least one of carbon nanotubes and carbon black.

Dyed lens and method of dyeing lens

A lens device includes a lens including an optical unit, and a rib portion extending outwardly of the optical unit in a radial direction, where the rib portion includes a light transmission region and a light blocking region, and where the light blocking region is disposed inside of the rib portion. The light blocking region may include a non-polar colorant. The lens may include a cyclic olefin compound. The lens device may include one or more lenses with rib portions with light transmission regions and light blocking regions, and may be a lens assembly with the one or more lenses.

Lens device and assembly

A semiconductor package includes a semiconductor chip having an active surface, on which a connection pad is disposed, and an inactive surface disposed to oppose the active surface, a heat dissipation member, disposed on the inactive surface of the semiconductor chip, having a plurality of holes and including a graphite-based material, an encapsulant covering at least a portion of each of the semiconductor chip and the heat dissipation member, and a connection member, disposed on the active surface of the semiconductor chip, including a redistribution layer electrically connected to the connection pad. 0&#x3c;b&#x3c;0.6a, in which 'a' denotes a planar area of the heat dissipation member and 'b' denotes a sum of planar areas of the plurality of holes on a plane.

Semiconductor package

A semiconductor package includes a semiconductor chip having an active surface on which a connection pad is disposed and an inactive surface opposing the active surface; a heat dissipation member disposed on the inactive surface of the semiconductor chip and including a graphite material; an adhesive member disposed between the semiconductor chip and the heat dissipation member; an encapsulant covering at least a portion of each of the semiconductor chip and the heat dissipation member; and an interconnect structure disposed on the active surface of the semiconductor chip and including a redistribution layer electrically connected to the connection pad. The encapsulant covers at least a portion of aside surface of the adhesive member.

A lens assembly includes a lens barrel formed of a first material, and a lens holder coupled to the lens barrel and formed of a second material, wherein a bonding portion in which the lens barrel and the lens holder are bonded to each other includes a mixed layer in which the first material and the second material are mixed with each other, and the bonding portion includes one or more voids.

Lens assembly, camera module, and mobile electronic device

A photoresist developer composition contains: a quaternary alkyl ammonium compound; and a corrosion inhibitor. The corrosion inhibitor contains a silane-based compound and an azole-based compound A manufacturing method of a semiconductor package includes using the photoresist developer composition.

Photoresist developer composition and manufacturing method of semiconductor package using the same

A camera module includes a lens module including a lens, and a base module configured to accommodate the lens module therein. A fluorinated lubricant is disposed on a portion of at least one of the lens module and the base module, the fluorinated lubricant includes a fluorescent material capable of emitting fluorescent light when illuminated with ultraviolet (UV) light.

Camera module, lubricant composition, and electronic device

A fan-out semiconductor package includes a semiconductor chip having an active surface on which connection pads are disposed and an inactive surface opposing the active surface, a heat dissipation member attached to the inactive surface of the semiconductor chip and having a thickness greater than a thickness of the semiconductor chip, an encapsulant encapsulating at least a portion of each of the semiconductor chip and the heat dissipation member, and a connection member disposed on the active surface of the semiconductor chip and including redistribution layers electrically connected to the connection pads, wherein the heat dissipation member is a complex of carbon and a metal.

Growing community of inventors

Suwon-si, South Korea

Sang Hyun Kwon