Samsung Display Co., Ltd.

Lg Electronics Inc.

Samsung Electro-mechanics Co., Ltd.

Samsung Electronics Co., Ltd.

Samsung Led Co., Ltd.

Sang Hyun Choi

Chang Hyun Lim

Seog Moon Choi

Sung Jun Lee

Woong Lin Hwang

Ho Joon Park

Chaun Gi Choi

Kwang Soo Bae

Sang Hyun Han

Yong Ho Lee

Young Nam Yun

Yong Hwan Park

Suk Hyung Kim

Tae Uk Kim

Min Jeong Oh

Hoon Gi Lee

Sung Soo Jun

A display device includes a base substrate; a thin-film transistor disposed on the base substrate; a via layer disposed on the thin-film transistor and having a via hole formed therein, the via hole penetrating the via layer in a thickness direction; a first electrode disposed on the via layer and having an electrode hole formed therein, the electrode hole penetrating the first electrode in the thickness direction; a bank layer disposed on the first electrode and exposing part of a top surface of the first electrode; an emission layer on the first electrode; and a second electrode on the emission layer, wherein the first is electrically connected to the thin-film transistor through the via hole, and the bank layer includes an outer bank pattern, which overlaps with the via hole in the thickness direction, and a bank island pattern, which is disposed in the electrode hole.

Display device

A touch sensing device includes first sensor electrodes disposed in a first area, second sensor electrodes disposed in a second area, first sensor lines each connected to the first sensor electrodes in the first area, and second sensor lines each connected to the second sensor electrodes in the second area. Each of the second sensor lines includes a first sub-sensor line disposed in the second area, and a second sub-sensor line disposed in the first area and the second area and connected to the first sub-sensor line.

Touch sensing unit and display device including the same

The present disclosure relates to a display device. According to an embodiment of the present disclosure, a display device includes a supporter including a plurality of segments disposed to be spaced apart from each other and defining a plurality of holes between the plurality of segments, and a display panel disposed on the supporter. The display panel includes: an active element layer including a light emitting element and a thin film transistor for driving the light emitting element, an encapsulation layer disposed on the active element layer, a plurality of stress dispersion pattern disposed on the encapsulation layer to overlap the plurality of holes in a thickness direction, and an insulating layer disposed on the plurality of stress dispersion pattern and filling a plurality of holes defined between the plurality of stress dispersion pattern.

Display device which is capable of dispersing stress applied thereto

An organic light emitting display device includes a substrate with a first emitting region adjacent a second emitting region, a first anode in the first emitting region, a first organic light emitting layer on the first anode, a second anode in the second emitting region, and a second organic light emitting layer on a part of the first anode and the second anode. The second organic light emitting layer includes a material different from the first organic light emitting layer.

Organic light emitting display device

Organic light emitting display device with color correction

The present invention provides an LED package and the fabrication method thereof. The present invention provides an LED package including a submount silicon substrate and insulating film and electrode patterns formed on the submount silicon substrate. The LED package also includes a spacer having a through hole, formed on the electrode patterns. The LED package further includes an LED received in the through hole, flip-chip bonded to the electrode patterns, and an optical element attached to the upper surface of the spacer.

Light emitting diode package and fabrication method thereof

Mobile phone

The present invention provides a light emitting diode (LED) package and the fabrication method thereof. The LED package includes a lower metal layer, and a first silicon layer, a first insulation layer, a second silicon layer, a second insulation layer, and a package electrode pattern formed in their order on the lower metal layer. The LED package also includes a spacer having a cavity, formed on the electrode pattern. The LED package further includes an LED mounted in the cavity by flip-chip bonding to the electrode patterns, and an optical element attached to the upper surface of the spacer.

PDP television receiver

The present invention relates to an LED package including photo diode. The LED package includes a silicon substrate, and a photo diode is formed in an upper part thereof. Also, an insulation layer is formed on the silicon substrate excluding at least a light-receiving area of the photodiode. In the LED package, an LED terminal is formed on the insulation layer to be connected to the photo diode. First and second LED connecting pads are formed on the insulation layer, and arranged on both sides of the photo diode. In addition, an LED chip is mounted on the silicon substrate, and connected to the first and second LED connecting pads.

Light emitting diode package including monitoring photodiode

There are provided an LED package using a Si substrate and a fabricating method of the LED package. In the LED package, a supporting structure includes a Si substrate and an insulating layer formed on top and bottom surfaces of the Si substrate, and the supporting structure defines at least one groove in a bottom surface by partially removing the Si substrate and the insulating layer. A plurality of upper electrodes is formed on a top surface of the supporting structure. At least one LED is mounted on the top surface of the supporting structure, and the LED includes both terminals electrically connected to the upper electrodes. A metal filler is filled in the groove defined in the bottom surface of the supporting structure.

LED package using Si substrate and fabricating method thereof

Monitor

Growing community of inventors

Seoul, South Korea

Sang Hyun Choi