Samsung Electronics Co., Ltd.

Sang-hwan Park

Kee-won Kim

Kwang-seok Kim

Young-Man Jang

Whan-Kyun Kim

Jae-Hoon Kim

Woo-Jin Kim

Sang-Yong Kim

Hee-Ju Shin

Young-Hyun Kim

A method of testing a semiconductor device includes respectively applying first to n-th voltages that change according to time to first to n-th semiconductor devices that are substantially same until the first to n-th semiconductor devices break down; calculating first to n-th stresses that define the total amount of stress respectively applied to the first to n-th semiconductor devices until a time when the first to n-th semiconductor devices break down, respectively, after the first to n-th voltages are applied; and calculating lifespan of the first to n-th semiconductor devices by using the first to n-th stresses.

Method of testing semiconductor device and method of manufacturing a semiconductor device including the testing method

A magnetoresistive random access memory device includes a free layer, a tunnel barrier layer, an insulation barrier layer, a pinned layer, and a vertical polarizer structure. The tunnel barrier layer and the insulation barrier layer directly contacts different surfaces of the free layer. The pinned layer structure contacts the tunnel barrier layer and includes at least one pinned layer. The vertical polarizer structure contacts the insulation barrier layer and includes a plurality of magnetization multi-layered structures sequentially stacked. Each magnetization multi-layered structure includes a non-magnetic layer and a magnetic layer sequentially stacked. The pinned layer and the magnetic layer have magnetization directions anti-parallel to each other.

Method of manufacturing magnetoresistive random access memory device

Magnetoresistive random access memory device and method of manufacturing the same

A magnetic device includes a free layer including a first magnetization layer; a pinned layer including a second magnetization layer; and a tunnel barrier layer provided between the free layer and the pinned layer. At least one selected from the free layer and the pinned layer includes a synthetic antiferromagnetic (SAF) structure formed of a first ferromagnetic layer, a second ferromagnetic layer, and a ruthenium-rhodium (Ru&#x2014;Rh) alloy layer provided between the first and second ferromagnetic layers.

Magnetic device

A magnetic device can include a tunnel bather and a hybrid magnetization layer disposed adjacent the tunnel barrier. The hybrid magnetization layer can include a first perpendicular magnetic anisotropy (PMA) layer, a second PMA layer, and an amorphous blocking layer disposed between the first and second PMA layers. The first PMA layer can include a multi-layer film in which a first layer formed of Co and a second layer formed of Pt or Pd are alternately stacked. A first dopant formed of an element different from those of the first and second layers can also be included in the first PMA layer. The second PMA layer can be disposed between the first PMA layer and the tunnel barrier, and can include at least one element selected from a group consisting of Co, Fe, and Ni.

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Hwaseong-si, South Korea

Sang-hwan Park