Electronics and Telecommunications Research Institute

Other

Korea Telecom

Wooriro Co., Ltd.

Korea Radioactive Waste Agency

Sang Hwan Lee

Min Kyu Song

Nam Hwang

Hee Tae Lee

Seung Goo Kang

Gwan Chong Joo

Chan Yong Park

Seong Su Park

Seung Hyun Kim

Kwang Eui Pyun

Min Soo Kim

Ki S Park

Chang Min Shin

Jeong Hwan Lee

Hong Man Kim

Hyung Ju Yun

Young Hye Kim

Man Ho Han

Chun Hyung Cho

Young Hae Kim

Provided is a backside illuminated avalanche photodiode and a manufacturing method thereof. The backside illuminated avalanche photodiode comprises a semiconductor substrate; a semiconductor structure including a first semiconductor layer being arranged on a front surface of the semiconductor substrate and including a first conductivity type bottom electrical contact layer, a light absorption layer, and a multiplication layer, and a second semiconductor layer, stacked on the first semiconductor layer and including an etch stop layer and a second conductivity type top electrical conductivity layer stacked on the etch stop layer; a plurality of V-grooves in parallel with each other being formed by etching the top electrical contact layer; and a reflective top electrode formed by depositing a multi layer thin metal films on the top electrical contact layer wherein plurality of V-grooves parallel with each other are formed.

Backside illuminated avalanche photodiode and manufacturing method thereof

A method for preventing corrosion of a spent nuclear fuel canister by using electrolytic corrosion protection, according to the present invention, has an effect of enabling a semi-permanent operation and, particularly, has effects of preventing oxidation and corrosion problems of a canister made of a metal material, in consideration of various environmental variables that may cause corrosion, and ensuring the structural stability of the canister so as to enable a semi-permanent operation.

Method for preventing corrosion of spent nuclear fuel canister by using electrolytic corrosion protection

An optical integrated circuit comprises optical waveguides, grooves formed by etching the upper cladding layer, the core layer and all or parts of the lower cladding layer close to a end section of the optical waveguide to intercept light transmitted through the core layer of the optical waveguide or to couple light into the core layer, a plurality of bonding pads formed around the groove, micro-mirrors and active optical elements. Such a PLC based optical integrated circuit and a method of manufacturing the same provides a low-cost manufacturing of optical integrated circuits and high quality mirrors for vertical optical coupling scheme.

Optical integrated circuit comprising light path turning micro-mirror inside the optical waveguide and method of manufacturing the same

A method for manufacturing a hetero-bonded wafer having a large mismatch of thermal expansion coefficient comprises forming a wafer bonding means and an electrical interconnection means on at least one bonding surface of two wafers to be bonded with each other, forming grooves in the bonding surface of one wafer along dicing lines with an interval between the grooves being equal to or an even multiple of a die width, bonding the two wafers at a temperature less than 200&#xb0; C., thinning a back side of the grooved wafer such that at least a portion of the grooves is exposed, and rebonding the bonded wafer pair at an elevated temperature higher than the first bonding temperature. The method for manufacturing a hetero-bonded wafer can avoid wafer level bow/warp and also reduce debonding and cracking in individual segments induced by thermal stress due to a mismatch of thermal expansion coefficient. Embodiments of the method are useful for wafer level packaging and the fabrication of hybrid devices by heterogeneous wafer bonding.

Method for manufacturing hetero-bonded wafer

The present invention relates to an optical integrated circuit; and, more particularly, to a method for preparing an improved hybrid optical integrated circuit which is capable of accommodating optical waveguides, optical devices, such as light emitting devices and light receiving devices, and optical fibers in an effective manner. The present invention has the advantages of minimizing horizontal misalignment error between the SOI waveguide rib area, the V-groove etch window and the alignment marks, decreasing the manufacturing cost by passively aligning the waveguides, the optical devices and the optical fibers on a single substrate. Also, the present invention has an effect of reducing fresnel reflection loss by providing the LPCVD silicon nitride layer capable of being used as an anti-reflection coating layer at both ends of the waveguide.

Method for fabricating a hybrid optical integrated circuit employing SOI optical waveguide

An optical switch module for aligning and fixing an optical fiber array relative to an optical switch device includes an optical fiber support member for fixing the optical fiber array; a first support device forming a homo-junction with the optical fiber support member and including a first thermal deformation buffer device; and a second support device forming a hetero-junction with the first support device to support the first support device and including a second thermal deformation buffer device.

Optical switch module having a buffer device for minimizing a post welding shift

A bidirectional optical communication module using a single optical fiber is disclosed. The module includes an optical fiber having a cut-away surface polished to have an acute angle between the cut-away surface and an axis of the optical fiber, a semiconductor laser emitting a transmission light coupled with a light fiber core, and a bidirectional optical device having a light receiving portion absorbing a receiving light outputted from the light fiber core for thereby optically coupling a bidirectional optical device in which a light receiving device is integrated into a light transmitting semiconductor laser as a single chip and an optical fiber when fabricating an optical module for implementing a light signal transmission and receiving operation using one optical fiber.

Bidirectional optical communication module using single optical fiber

Disclosed is a micromirror for a hybrid optoelectronic integrated circuit, a method for manufacturing the same, a micromirror-photodetector assembly and an assembly of hybrid optoelectronic integrated circuit for receiving light. The micromirror the present invention comprises a silicon substrate and at least one V-shaped groove formed in the silicon substrate and the V-shaped groove has an inclined surface reflecting light emitted from an optical waveguide to a photodetector. The alignment of the photodetector and the optical fibers is achieved without an additional attachment equipment, by inserting the optical fibers into the V-groove.

Micromirror for a hybrid optoelectronic integrated circuit, a method for

Growing community of inventors

Daejeon, South Korea

Sang Hwan Lee