Samsung Electro-mechanics Co., Ltd.

Sang Hoon Kwon

Chang Hoon Kim

Myung Jun Park

Kang Heon Hur

Hyun Hee Gu

Seok Hyun Yoon

Jae Young Park

Byung Jun Jeon

Kyu Ha Lee

Da Young Choi

Sang Hyuk Kim

Byoung Hwa Lee

Sung Hyung Kang

Chang Hak Choi

Ji Young Park

Kum Jin Park

Hyung Joon Jeon

Hyo Sub Kim

Soon Mo Song

Gun Woo Kim

Seok Joon Hwang

Hye Young Baeg

Jae Yeol Choi

Doo Young Kim

Je Jung Kim

Hye Young Choi

Du Won Choi

Eun Sang Na

Hyo Jung Kim

Kyoung Jin Jun

Sung Bum Sohn

Min Sung Song

Sun Ho Yoon

Joon Yeob Cho

Han Soung Jeong

Byung Gyun Kim

Jung Hwan Kim

There is provided a laminated ceramic electronic component, including a ceramic body including a dielectric layer; and first and second internal electrodes disposed to face each other, having the dielectric layer interposed therebetween within the ceramic body, wherein when a value of 1% is set to be D1, a value of 50% is set to be D50, and a value of 99% is set to be D99 in a cumulative distribution of dielectric grains by an average particle diameter thereof within the dielectric layer, 2&#x2266;D99/D50&#x2266;3 and 2&#x2266;D50/D1&#x2266;3 are satisfied. A high-capacity laminated ceramic electronic component may be implemented with improved adhesion between the dielectric layer and the internal electrode, and improved withstand voltage characteristics and excellent reliability may be implemented.

Laminated ceramic electronic component and method of fabricating the same

There is provided a dielectric composition, including; a base powder including BaTiO(0.995&#x2266;m&#x2266;1.010); a first sub-component including 0.05 to 4.00 moles of an oxide or carbonate containing at least one rare-earth element based on 100 moles of the base powder; a second sub-component including 0.05 to 0.70 moles of an oxide or carbonate containing at least one transition metal; a third sub-component including 0.20 to 2.00 moles of a Si oxide; a fourth sub-component including 0.02 to 1.00 mole of an Al oxide; and a fifth sub-component including 20 to 140% of an oxide containing at least one of Ba and Ca, based on the third sub-component.

Dielectric composition and ceramic electronic component including the same

There are provided a laminated ceramic electronic component and a method of fabricating the same. The laminated ceramic electronic component include a ceramic body including a dielectric layer; and first and second internal electrodes disposed to face each other, having the dielectric layer interposed therebetween within the ceramic body, wherein the ceramic body includes an active layer that is a capacitance forming part and a cover layer that is a non-capacitance forming part formed on at least one of a top surface and a bottom surface of the active layer, and when a thickness of the ceramic body is t and a thickness of the cover layer is T, T&#x2266;t&#xd7;0.05 is satisfied and when an average particle diameter of a dielectric grain in the active layer is Da and an average particle diameter of a dielectric grain in the cover layer is Dc, 0.7&#x2266;Dc/Da&#x2266;1.5 is satisfied.

Laminated ceramic electronic component having a cover layer with dielectric grains and method of fabricating the same

There are provided a method of manufacturing perovskite powder, and perovskite powder and a multilayer ceramic electronic component manufactured thereof. The manufacturing method includes: washing metal oxide hydrate to remove impurities therefrom; adding pure water and an acid or a base to the metal oxide hydrate to prepare a metal oxide sol; mixing the metal oxide sol with a metal salt to form perovskite particle nuclei; and conducting grain growth of the perovskite particle nuclei by hydrothermal treatment to produce perovskite powder. The method of manufacturing perovskite powder and the perovskite powder manufactured by the same have advantages such as excellent crystallinity, reduced generation of fine powder, and favorable dispersion properties.

Method of manufacturing perovskite powder, perovskite powder manufactured by the same and multilayer ceramic electronic component

There are provided a multilayer ceramic electronic component and a method of manufacturing the same. Here, an average diameter (D) of ceramic grains in a cover area is smaller than an average diameter (D) of ceramic grains in the active area, and when a thickness of the cover area is expressed by Tc, 9 um&#x2266;Tc&#x2266;25 um and Tc/Dc&#x2267;55 are satisfied. A multilayer ceramic capacitor having excellent moisture-resistance properties may be obtained.

Multilayer ceramic electronic component and method of manufacturing the same

There is provided a dielectric composition including: a base powder including BaTiO; a first accessory component including a content (x1) of 0.1 to 1.0 at % of an oxide or a carbonate including transition metals, based on 100 moles of the base powder; a second accessory component including a content (y) of 0.01 to 3.0 at % of oxide or carbonate including a fixed valence acceptor element, based on 100 moles of the base powder; a third accessory component including an oxide or a carbonate including a Ce element (content of z at %) and at least one rare earth element (content of w at %); and a fourth accessory component including a sintering aid, wherein 0.01&#x2266;z&#x2266;x1+4y and 0.01&#x2266;z+w&#x2266;x1+4y based on 100 moles of the base powder.

There are provided a multilayer ceramic electronic component and a method of manufacturing the same. The multilayer ceramic electronic component includes: a ceramic body including a dielectric layer; first and second internal electrodes disposed within the ceramic body to face each other, while having the dielectric layer interposed therebetween; and first external electrodes electrically connected to first and second internal electrodes and second external electrodes formed on the first external electrodes, wherein the first and second external electrodes include a conductive metal and a glass, and when the second external electrodes are divided into three equal parts in a thickness direction, an area of the glass in central parts thereof with respect to an area of the central parts is 30 to 80%. Therefore, sealing properties of a chip is improved, whereby a multilayer ceramic electronic component having improved reliability may be implemented.

Multilayer ceramic electronic component

There are provided a multilayer ceramic electronic component comprising: a ceramic main body including a dielectric layer and having first and second main faces, third and fourth side faces opposed in a length direction, and fifth and sixth faces opposed in a width direction; first and second internal electrodes; and one or more first external electrodes formed on the fifth face and one or more second external electrodes formed on the sixth face, wherein the first and second external electrodes have an average thickness ranging from 3 &#x3bc;m to 30 &#x3bc;m, and when at least one of the first and second external electrodes is divided into three equal parts in a thickness direction, an area of glass in central area portions thereof is 35% to 80% of the total areas of the central area portions.

Multilayer ceramic electronic component and fabrication method thereof

There is provided a multilayer ceramic electronic component, including: a ceramic body including a dielectric layer; a plurality of internal electrodes disposed to face each other within the ceramic body, having the dielectric layer interposed therebetween; and external electrodes electrically connected to the internal electrodes, wherein the ceramic body includes an active layer corresponding to a capacitance forming part and a cover layer formed on at least one of an upper surface and a lower surface of the active layer and corresponding to a non-capacitance forming part, an average thickness of the cover layer is 15 &#x3bc;m or less, the external electrodes include a conductive metal and a glass, and when an area of the external electrodes occupied by the glass is A and an area thereof occupied by the conductive metal is B, 0.05&#x2266;A/B&#x2266;0.6 is satisfied.

Multilayer ceramic electronic component and method of fabricating the same

There are provided a method of manufacturing a ceramic powder having a perovskite structure and a ceramic powder having a perovskite structure manufactured by the same. The method includes: mixing a compound of an element corresponding to site A in an ABOperovskite structure as well as a compound of an element corresponding to site B in the same structure, with supercritical water in a continuous mode to form seed crystals; and mixing the seed crystals in a batch mode to conduct grain growth thereof.

Method of manufacturing ceramic powder having perovskite structure and ceramic powder having perovskite structure manufactured using the same

There is provided a multilayer ceramic electronic component including: a ceramic body including a dielectric layer; a plurality of internal electrodes disposed within the ceramic body to face each other, having the dielectric layer interposed therebetween; and external electrodes electrically connected to the plurality of internal electrodes, wherein the ceramic body includes an active layer corresponding to a capacitance forming part and a cover layer formed on at least one of an upper surface and a lower surface of the active layer and corresponding to a non-capacitance forming part, an average thickness of the cover layer is 15 &#x3bc;m or less, the external electrodes include a conductive metal and glass portions, and when an average length of the glass portions in a length direction of the external electrodes is Ls, Ls&#x2266;10 &#x3bc;m is satisfied.

There are provided a multilayer ceramic electronic component, and a method of fabricating the same. The multilayer ceramic electronic component includes: a ceramic main body including a dielectric layer; first and second internal electrodes disposed to face each other within the ceramic main body; and a first external electrode and a second external electrode, wherein the first and second external electrodes include a conductive metal and glass, and when at least one of the first and second external electrodes is divided into three equal parts in a thickness direction, an area of the glass in a central part thereof is 35% to 80% of the total area of the central part. A multilayer ceramic electronic component having improved reliability may be implemented by enhancing chip air-tightness.

There are provided a conductive paste for an external electrode, a multilayered ceramic electronic component using the same, and a fabrication method thereof. The conductive paste for external electrode includes: a conductive metal; and a conductive amorphous metal including a (Cu, Ni)-bZr-c(Al, Sn) that satisfies conditions of a+b+c=100, 20&#x2266;a&#x2266;60, 20&#x2266;b&#x2266;60, and 2&#x2266;c&#x2266;25. A degradation of connectivity between external electrodes and internal electrodes and defective plating due to a glass detachment may be solved.

Conductive paste for external electrode, multilayered ceramic electronic component using the same and fabrication method thereof

There is provided a multilayer ceramic electronic component, including: a ceramic element having a plurality of dielectric layers laminated therein; and first and second internal electrodes formed within the ceramic element, wherein the first and second internal electrodes include 80 to 99.98 wt % of nickel (Ni), 0.01 to 10 wt % of copper (Cu), and 0.01 to 10 wt % of barium titanate (BaTiO).

Disclosed herein is an apparatus for synthesizing nano particles. The apparatus for synthesizing nano particles is configured to include: a plasma generator that generates plasma; a recovery device that recovers the synthesized nano particles; and a cooler that is disposed between the plasma generator and the recovery device and includes a cooling path where the nano particles are synthesized, while material supplied from the plasma generator is cooled, wherein the cooling path is set to have lower cooling temperatures for each section as going to the moving direction of the nano particles.

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Gyunggi-do, South Korea

Sang Hoon Kwon