Samsung Electro-mechanics Co., Ltd.

Samsung Electronics Co., Ltd.

Other

Sungkyunkwan University

Sang Hoon Kim

Jae Hyun Jung

Han Seo Cho

Joon Sung Kim

Young Kuk Ko

Chi Won Hwang

Suk Chang Hong

Young Bal Kim

Hea Sung Kim

Wan Soo Kim

Gyu Mook Kim

Yong Duk Lee

Joo Yul Ko

Woo Young Choi

Joo Hyoung Lee

Yoong Oh

Chan Hoon Ko

Ki Won Kim

Min-Hyo Seo

Jung Nyoung Heo

Jae Hyuk Choi

Dong Sub Kim

Se Hoon Kim

Je Gwang Yoo

Ji-Yeon Son

Yong Soon Jang

Bong-Oh Kim

Chulmin Joo

Chang Tae Kim

Seok Gu Kang

Yong Min Huh

Sang Woo Bae

Min Jae Seong

Seung Jae Oh

Jong Hee Chang

Duck Young Maeng

Ji-Hye Choi

Hye Yeong Nam

Yeo Jin Kim

Jin Suck Suh

Jung Hoon Chun

Youngbin Ji

Sung Gu Kim

Hee Jun Ryu

Ki Hee Cho

Woo Jeong Choi

Yong Chul Yoon

Cheol Min Shin

Sung Bin Hong

Kee Su Jeon

Ki Gon Kim

Joung Woo Choi

Goo Young Kim

So Jin Lee

He Len Cho

Min Hyuk Yun

A printed circuit board includes: a first insulating layer having at least one recess portion in one surface thereof; a first wiring layer embedded in one surface of the first insulating layer; and a first via layer including a first via penetrating through at least a portion of the first insulating layer, one surface of the first via being exposed externally through the recess portion.

Printed circuit board and electronic component package including the same

A printed circuit board includes: a substrate layer in which a plurality of insulating layers and a plurality of wiring patterns are repeatedly layered, the substrate layer including a conductive via layer disposed in one of the plurality of insulating layers to connect wiring patterns, among the plurality of wiring patterns, disposed on upper and lower surfaces of the one insulating layer, respectively; an uppermost substrate layer including an outermost insulating layer disposed outermost within the substrate layer, and a first upper wiring pattern disposed in the outermost insulating layer; and a bump pad disposed on a portion of an upper surface of the first upper wiring pattern and having a length shorter than a length of the first upper wiring pattern.

Printed circuit board and electronic component package

A printed circuit board includes: an insulating member; a first bump disposed on the insulating member; a second bump disposed adjacently to but spaced apart from the first bump on the insulating member; a first insulating wall covering at least a portion of the first bump; and a second insulating wall covering at least a portion of the second bump and disposed adjacently to but spaced apart from the first insulating wall.

Printed circuit board and method for manufacturing the same

A printed circuit board includes a first insulating layer, a metal pad including a first metal portion disposed on the first insulating layer, and a second metal portion disposed on the first metal portion and integrated with the first metal portion without a boundary therebetween, the second metal portion having a width narrower than a width of the first metal portion on a cross section, a second insulating layer disposed on the first insulating layer and covering at least a portion of a side surface of the first metal portion, and a surface metal layer disposed on the metal pad and covering at least a portion of each of an upper surface and a side surface of the second metal portion.

Printed circuit board

A printed circuit board includes a first insulating layer; a pad disposed on the insulating layer and having a protrusion; and a protective layer disposed on the insulating layer and having an opening exposing at least a portion of the pad. The protrusion protrudes from one surface of the pad and is buried in at least one of the insulating layer and the protective layer.

A printed circuit board includes: an insulating layer; a plurality of pads disposed on the insulating layer; and a plurality of insulating walls disposed on the insulating layer, and at least partially covering side surfaces of the plurality of pads, respectively, while being free from surfaces of the plurality of pads, respectively. The plurality of insulating walls are disposed to be spaced apart from each other on the insulating layer.

A printed circuit board includes: a first insulating layer; a first cavity disposed in one surface of the first insulating layer; a plurality of protrusion portions spaced apart from each other in the first cavity; and a first wiring layer embedded in the one surface of the first insulating layer.

The present disclosure relates to a printed circuit board and a method of manufacturing the same. The printed circuit board includes: an insulating layer; a plurality of pads disposed on the insulating layer; and a plurality of insulating walls that are disposed on the insulating layer and cover side surfaces of the plurality of pads, respectively, but are not disposed on upper surfaces of the plurality of pads. The plurality of insulating walls are disposed to be spaced apart from each other on the first insulating layer.

Printed circuit board and method of manufacturing the same

An antenna module includes an integrated circuit (IC), a substrate having a first region having one or more antenna disposed on a surface thereof and a second region flexibly bent and electrically connected to the IC to provide an electrical connection path to the one or more antenna and the IC, a set substrate electrically connected to the IC, and a set module disposed on the set substrate between the set substrate and the first region.

Antenna module including a flexible substrate

A printed circuit board includes a first substrate portion including a first insulating layer and a first wiring layer; and a second substrate portion disposed on the first substrate portion and including a second insulating layer, a pad disposed on the second insulating layer, and a first via penetrating through the second insulating layer and connecting the first wiring layer and the pad to each other. The first via has a boundary with each of the first wiring layer and the pad, and includes a first metal layer and a second metal layer disposed on different levels.

An antenna module includes an integrated circuit (IC) that is configured to generate an RF signal, a substrate providing a first surface on which one or more first antenna is arranged, a second surface on which the IC is arranged, and an electrical connection path to the one or more first antenna and the IC, and a flexible substrate connected to the substrate to provide a third surface on which one or more second antenna is arranged and to provide an electrical connection path to the one or more second antenna and the IC.

A printed circuit board includes: a first insulating layer; a first wiring layer at least partially buried in the first insulating layer; a second insulating layer disposed on an upper surface of the first insulating layer; a second wiring layer at least partially buried in the second insulating layer; and a cavity penetrating through the second insulating layer and a portion of the first insulating layer and exposing a portion of the upper surface of the first insulating layer as a bottom surface of the cavity. The first wiring layer includes a wiring pattern at least partially exposed from the first insulating layer by the cavity, an upper surface of the wiring pattern has a step structure with the upper surface of the first insulating layer exposed by the cavity, and a lower surface of the wiring pattern is coplanar with a lower surface of the first insulating layer.

Disclosed are a pharmaceutical composition for anionic drug delivery, and a preparation method therefor, the pharmaceutical composition for anionic drug delivery containing: an anionic drug as an active ingredient; a cationic compound; an amphiphilic block copolymer; and a polylactate, wherein the anionic drug formed a complex with the cationic lipid, and the complex is encapsulated within a micelle structure formed by the amphiphilic block copolymer and the polylactate.

Pharmaceutical composition containing anionic drug, and preparation method therefor

An electronic device according to an embodiment may comprise: a speaker, an amplifier connected to the speaker through a first electrical path; and at least one processor electrically connected to the amplifier, wherein the at least one processor is configured to: provide a first audio signal set to a first volume level to the speaker via the amplifier; when the first volume level is less than a predetermined first value, output the first audio signal at the first volume level through the speaker; and when the first volume level is equal to or greater than the first value, control a volume level of the first audio signal on the basis of a temperature value of the speaker, which is estimated from the first audio signal.

Electronic device comprising speaker

Growing community of inventors

Suwon-si, South Korea

Sang Hoon Kim