Samsung Electronics Co., Ltd.

Sang-Ho Shin

Cheol Su Kim

Jung-Sik Kim

Jung-Bae Lee

Young-Soo Sohn

Satoru Yamada

Min-hee Cho

Joo-sun Choi

Sung-Sam Lee

Tae-seong Jang

Sung-Min Yim

Sei-Jin Kim

Chan-yong Lee

Hee-Sub Shin

Young-Il Lim

Min-Jeung Cho

A memory chip includes a chip input-output pad unit, a plurality of semiconductor dies. The chip input-output pad unit includes a plurality of input-output pins connected to an external device and the plurality of semiconductor dies are connected commonly to the chip input-output pad unit and having a full memory capacity respectively. Each semiconductor die includes a die input-output pad unit, a memory region and a conversion block. The die input-output pad unit includes a plurality of input-output terminals respectively connected to the input-output pins of the chip input-output pad unit. The memory region includes an activated region corresponding to a portion of the full memory capacity and a deactivated region corresponding to a remainder portion of the full memory capacity. The conversion block connects the activated region except the deactivated region to the die input-output pad unit.

Address-remapped memory chip, memory module and memory system including the same

A semiconductor memory device includes a cell array and a refresh controller coupled to the cell array. The refresh controller is configured to insert at least one insertion refresh address in a first refresh address sequence based on address information about the cell array to generate a second refresh address sequence and to apply the second refresh address sequence to the cell array, such that selected cells may be refreshed more frequently without increasing an overall refresh rate.

Semiconductor memory device that controls refresh period, memory system and operating method thereof

A memory device to correct a defect cell generated after packing is performed includes a memory cell array in which a plurality of memory cells are arranged, a repair circuit unit including a first storage unit to store defect cell information in the memory cell array, and a fuse circuit unit including a second storage unit that is programmed according to the defect cell information stored in the first storage unit. The first storage unit includes a volatile memory device, and the second storage unit includes a non-volatile memory device.

Memory device to correct defect cell generated after packaging

A semiconductor memory device includes: a memory unit including a first memory sub region including a first memory cell and a second memory sub region including a second memory cell; a temperature information obtaining unit that obtains temperature information; a temperature estimation unit that estimates a first temperature of the first memory sub region and a second temperature of the second memory sub region based on the temperature information; a first sub region control unit that controls the first memory sub region based on the first temperature; and a second sub region control unit that controls the second memory sub region based on the second temperature.

Semiconductor memory device and semiconductor package

The present disclosure relates to an apparatus and method capable of carrying out data movement in a memory of a terminal. The apparatus includes a processor configured to transmit a command for data movement and address information for data movement in a memory to the memory, and the memory configured to perform the data movement in units of word line in the memory by using the address information, in response to reception of the command for moving the data.

Apparatus and method for data movement

A semiconductor memory device having improved refresh characteristics includes a memory array including a plurality of memory cells; a test unit configured to test refresh characteristics of the memory array and generate a first fail address signal; a storage unit configured to store the first fail address signal; and a refresh unit configured to perform a refresh operation on the memory array, wherein the refresh unit is configured to receive the first fail address signal from the storage unit, perform the refresh operation on a first memory cell that does not correspond to the first fail address signal according to a first period, and perform the refresh operation on a second memory cell that corresponds to the first fail address signal according to a second period that is shorter than the first period.

Semiconductor memory device having improved refresh characteristics

A refresh circuit and a semiconductor memory device including the refresh circuit are disclosed. The refresh circuit includes a mode register, a refresh controller and a multiplexer circuit. The mode register generates a mode register signal having information relating to a memory bank on which a refresh operation is to be performed. The refresh controller generates a self-refresh active command and a self-refresh address based on a self-refresh command and an oscillation signal. The multiplexer circuit may include a plurality of multiplexers. Each of the multiplexers selects one of an active command and the self-refresh active command in response to bits of the mode register signal. Each of the multiplexers generates a row active signal based on the selected command, and selects one of an external address and the self-refresh address to generate a row address.

Refresh circuit of a semiconductor memory device and refresh control method of the semiconductor memory device

A memory device includes an anti-fuse cell array including a plurality of anti-fuse cells. Each anti-fuse cell includes a first cell transistor connected to a common node, a second cell transistor connected to the common node, and an access transistor connected to the common node. The first cell transistor is configured to store data and the second cell transistor is configured to store data when the first cell transistor has defect data.

Growing community of inventors

Yongin-si, South Korea

Sang-Ho Shin