Amkor Technology Singapore Holding Pte. Ltd.

Sang Goo Kang

Won Bae Bang

Seung Woo Lee

Byong Jin Kim

Dong Joo Park

Jae Yun Kim

Jin Young Khim

Shaun Bowers

Ju Hyung Lee

Min Hwa Chang

Gi Tae Lim

Gyu Wan Han

Se Hwan Hong

Myung Jea Choi

Byoung Woo Cho

Seung Jae Yu

Seul Bee Lee

Kyung Rok Park

In one example, a semiconductor device can comprise a substrate, a device stack, first and second internal interconnects, and an encapsulant. The substrate can comprise a first and second substrate sides opposite each other, a substrate outer sidewall between the first substrate side and the second substrate side, and a substrate inner sidewall defining a cavity between the first substrate side and the second substrate side. The device stack can be in the cavity and can comprise a first electronic device, and a second electronic device stacked on the first electronic device. The first internal interconnect can be coupled to the substrate and the device stack. The encapsulant can cover the substrate inner sidewall and the device stack and can fill the cavity. Other examples and related methods are disclosed herein.

Semiconductor devices and related methods

Provided are a method for fabricating a semiconductor package and a semiconductor package using the same, which can simplify a fabricating process of the semiconductor package by forming a lead frame on which a semiconductor die can be mounted without a separate grinding process, and can improve product reliability by preventing warpage from occurring during a grinding process. In one embodiment, the method for fabricating a semiconductor package includes forming a frame on a carrier, forming a first pattern layer on the frame, first encapsulating the frame and the first pattern layer using a first encapsulant, forming conductive vias electrically connected to the first pattern layer while passing through the first encapsulant, forming a second pattern layer electrically connected to the conductive vias on the first encapsulant, forming a first solder mask formed on the first encapsulant and exposing a portion of the second pattern layer to the outside, removing the frame by an etching process and etching a portion of the first pattern layer, and attaching a semiconductor die to the first pattern layer.

Method for fabricating semiconductor package and semiconductor package using the same

Growing community of inventors

Seoul, South Korea

Sang Goo Kang