Samsung Electronics Co., Ltd.

Sang-Geun Kim

Jin-Soo Kim

Seog-Guen Kim

Yoon-Young Kim

Jin-Hee Cho

Yong-Jin Lee

Jeong-Hoon Kim

Seok-Yong Lee

Seok Goh

Jong-Kwon Ko

Yong Seok Seo

Bong-Gun Lee

Yo-Se Eum

Seung-Chul Ahn

Sang-Woon Nahm

Sang-Yul Kim

Dong-Chul Han

Seung-Chui Ahn

Nam-Jun Kim

A method of forming external terminals of a package is provided in which a package substrate may be fixed, an edge portion of the package substrate may be supported to prevent the edge portion of the package substrate from being upwardly bent, a mask having openings may be arranged on the package substrate, and the external terminals may be supplied to the package substrate through the openings of the mask. The supporting portion may downwardly press the edge portion of the package substrate so that the edge portion of the package substrate may not be upwardly bent. As a result, the external terminals on the package substrate may have a uniform thickness.

Method of forming external terminals of a package and apparatus for performing the same

A protection cover and a portable apparatus including the same are provided. The protection cover includes a front cover, a rear cover, and a coupling member. The front cover is mountable on the portable apparatus and covers a screen of the portable apparatus. The coupling member is formed of a flexible material such that the front cover is pivotable between and open and a closed position. The rear cover is mounted on the backside of the portable apparatus to serve as a rear case of the portable apparatus. The coupling member is integrally coupled with the front cover and separably coupled with the rear cover. According to the above structure, the protection cover can minimize the total volume and dimensions of the portable apparatus after it is mounted.

Protection cover and portable apparatus having the same

A protection cover for a portable terminal preferably includes a rear cover, on and from a surface of which the portable terminal is mountable and removable, and a front cover pivotally coupled to the rear cover to open or close access to the portable terminal mounted on the rear cover. Friction members may be provided on at least one of the rear cover and the front cover, respectively, in which the front cover is disposed at a predetermined angle with respect to the rear cover while facing another surface of the rear cover to support the friction members on a planar surface, thereby opening the portable terminal and cradling the portable terminal inclinedly with respect to the planar surface. The protection cover provides both a cradle and a cover in one device.

Protection cover for portable terminal

A stacked package and method of manufacture are provided. The stacked package may include a first semiconductor package, a second semiconductor package, plugs and spacers. The second semiconductor package may be stacked on the first semiconductor package. The plugs may electrically connect the first semiconductor to the second semiconductor package. The spacer may be interposed between the first semiconductor package and the second semiconductor package to form a gap between the first semiconductor package and the second semiconductor package, thereby preventing an electrical short between the plugs.

Stacked package including spacers and method of manufacturing the same

Die bonding equipment for fine pitch ball grid array package includes: a semiconductor chip pickup stage for inspecting a status of a loaded semiconductor chip and a corresponding position thereof; an alignment stage on which the semiconductor chip fixed on a mount head is aligned; a chip transfer unit for transferring the semiconductor chip from the semiconductor chip pickup stage to the alignment stage; a guide rail for guiding a mount tape frame; a status inspecting unit disposed at a selected position over the guide rail, for inspecting a status and a position of the land pattern on the mount tape frame; and a bonding unit for bonding the land pattern to the semiconductor chip which is mounted on the mount head. The equipment only bonds semiconductor chips (good or defective) to lands patterns having the same status (good or defective).

Die bonding equipment

Die bonding method for manufacturing fine pitch ball grid array packages

A frequency using method for minimizing a time for an initial synchronization between a mobile station and a base station in a mobile telecommunication system. The frequency using method includes the steps of inputting current time data; reading out an initial synchronization frequency from an internal memory; determining an initial synchronization hopping frequency and an initial synchronization hopping cycle according to a hopping pattern polynomial and the current time data; and sequentially searching for frequencies within a communication channel on a one-by-one basis according to the initial synchronization hopping frequency and the initial synchronization hopping cycle to produce a synchronized frequency to establish synchronization between the mobile station and the base station.

Method for minimizing time to establish initial synchronization between

Growing community of inventors

Cheonan-si, South Korea

Sang-Geun Kim