Samsung Electronics Co., Ltd.

Samsung Display Co., Ltd.

Dongwoo Fine-chem Co., Ltd.

Sang-Gab Kim

Hong-Kee Chin

Yu-Gwang Jeong

Min-Seok Oh

Seung-Ha Choi

Shin-Il Choi

Shi-Yul Kim

Jang-Soo Kim

Hee-Hwan Choe

Mun-Pyo Hong

Woo-Geun Lee

Ji-Young Park

Jeong-Min Park

Dong-Ju Yang

Hong-Sick Park

Young-Wook Lee

Ki-Yeup Lee

Kwan-Wook Jung

Hye-Young Ryu

Yun-Jong Yeo

Wan-Shick Hong

Sang-Woo Whangbo

Joon-Hoo Choi

Chang-Oh Jeong

Dae-Ho Kim

Hi-Kuk Lee

Jong-Hyun Choung

Byeong-Beom Kim

Joo-han Kim

Sung-Chul Kang

Jung-Suk Bang

Ki-Hun Jeong

Sung-Hoon Yang

Jin-Ho Ju

Kap-Soo Yoon

Bo Sung Kim

Yang-Ho Bae

Pil-Sang Yun

Hyun-Eok Shin

Seung-Hwan Shim

Ho-Min Kang

Myoung-Geun Cha

Jang-Kun Song

Chong-Chul Chai

Jae-Hong Kim

Ki-Won Kim

Bong-Kyun Kim

Byeong-Jin Lee

Jae-Hyoung Youn

Jong-In Kim

Ho-Jun Lee

Eun-Guk Lee

Sun-Young Hong

Seung-Hee Lee

Hee-Joon Kim

Woong-Kwon Kim

Yeo-Geon Yoon

Chang-Hoon Kim

Dae-Jin Kwon

Yong-Mo Choi

Doo-Hee Jung

Seon-Il Kim

Soo-Wan Yoon

Bong-Won Lee

Jun-Hyung Souk

Soo-Jin Kim

Hyun-Jae Na

Ki-Yong Song

Nam-Seok Suh

Dong-Hoon Lee

Jin-Koo Chung

Je-Hun Lee

Bo-Sung Kim

Beohm-Rock Choi

Jae-Ho Choi

Keun-Kyu Song

Yoon-Ho Khang

Soo-Guy Rho

Beom-Seok Cho

Sang-tae Kim

Yong-Su Lee

Se-Hwan Yu

Joo-Ae Youn

Hyun-Min Cho

Gyungmin Baek

Jin-Su Byun

Sangwoo Sohn

Jung-Ha Son

Young-Chul Park

Takayuki Fukasawa

Sung-Haeng Cho

Beom-Rak Choi

In-Bae Kim

In-Ho Yu

Suck-Jun Lee

Joon-Woo Lee

Sang-Hoon Jang

Sang-Won Shin

Young-Jun Jin

Yu Gwang Jeong

A display substrate may include a substrate and a wiring on the substrate. The wiring may include a metal oxide layer including at least one oxide selected from tantalum (Ta), niobium (Nb), and titanium (Ti), and a metal layer on the metal oxide layer and including copper (Cu), and a thickness of the metal oxide layer may be in a range of about 30 angstroms (Å) to about 50 Å.

Display substrate, manufacturing method therefor, and display device including same

An OLED display device includes a substrate including a display region and a pad region, a display structure in the display region on the substrate, and a pad electrode structure in the pad region on the substrate, the pad electrode structure having a first pad electrode on the substrate, a first insulation layer covering opposite lateral portions of the first pad electrode and exposing a portion of an upper surface of the first pad electrode, a second pad electrode on the first pad electrode and on the first insulation layer, the second pad electrode having a step portion where the first pad electrode and the first insulation layer are overlapped, and a third pad electrode on the second pad electrode and on the first insulation layer, the third electrode covering the second pad electrode.

Organic light emitting display device

Organic light emitting diode display device

A display substrate includes an active pattern, a gate electrode, a first insulation layer and a pixel electrode. The active pattern is disposed on a base substrate. The active pattern includes a metal oxide semiconductor. The gate electrode overlaps the active pattern. The first insulation layer covers the gate electrode and the active pattern, and a contact hole is defined in the first insulation layer. The pixel electrode is electrically connected to the active pattern via the contact hole penetrating the first insulation layer. A first angle defined by a bottom surface of the first insulation layer and a sidewall of the first insulation layer exposed by the contact hole is between about 30&#xb0; and about 50&#xb0;.

Display substrate and method of manufacturing a display substrate

A display substrate includes a base substrate, a common line on the base substrate, a first insulation layer covering the common line and having a first insulating material, a conductive pattern on the first insulation layer and including a source electrode and a drain electrode, a second insulation layer covering the drain electrode and the common line, and including a lower second insulation layer having a second insulating material and an upper second insulation layer having the first insulating material, a first electrode electrically connected to the drain electrode through a first contact hole in the second insulation layer, and a second electrode electrically connected to the common line through a second contact hole in the first and second insulation layers. The upper and lower second insulation layers on the drain electrode have a first hole and a second hole respectively that form the first contact hole.

Display substrate and method of manufacturing the display substrate

A contact portion of wiring and a method of manufacturing the same are disclosed. A contact portion of wiring according to an embodiment includes: a substrate; a conductive layer disposed on the substrate; an interlayer insulating layer disposed on the conductive layer and having a contact hole; a metal layer disposed on the conductive layer and filling the contact hole; and a transparent electrode disposed on the interlayer insulating layer and connected to the metal layer, wherein the interlayer insulating layer includes a lower insulating layer and an upper insulating layer disposed on the lower insulating layer, the lower insulating layer is undercut at the contact hole, and the metal layer fills in the portion where the lower insulating layer is undercut.

Contact portion of wire and manufacturing method thereof

A display apparatus includes: a substrate defining transistor and wiring areas; a thin film transistor in the transistor area and including a gate electrode, an active layer, and source and drain electrodes; an etch prevention layer in the transistor area, absent in the wiring area and covering the active layer, and first and second contact holes defined in the etch prevention layer and through which the active layer is electrically coupled to the source and drain electrodes; a first wiring layer in the wiring area; a first insulating layer which covers the gate electrode and the first wiring layer, and a third contact hole defined in the first insulating layer in the wiring area and exposing the first wiring layer; and a second wiring layer on the first insulating layer and in the wiring area, and electrically coupled to the first wiring layer via the third contact hole.

Display apparatus and method of manufacturing the same

A display substrate includes a base substrate, a switching element, a protecting layer, an organic layer, a first pixel electrode and a second pixel electrode. The switching element is on the base substrate, and includes a gate electrode, a source electrode and a drain electrode. The protecting layer is on the switching element, and includes a first hole exposing the drain electrode. The organic layer is on the protecting layer, and includes a second hole which exposes a side surface of the protecting layer which defines the first hole and exposes a top surface of the protecting layer which is adjacent to the side surface of the protecting layer. The first pixel electrode is on the organic layer. The second pixel electrode overlaps the first pixel electrode, and is electrically connected to the drain electrode via the first and second holes.

Display substrate including organic layer and method of manufacturing the same

A display substrate includes a data pad on a base substrate, a first buffer layer which covers the data pad, a second buffer layer pattern which is disposed on the first buffer layer and separated from the data pad in a plan view, an active layer on the second buffer layer pattern, a gate insulation layer pattern on the active layer, both ends of the active layer exposed by the gate insulation layer pattern, and a gate electrode on the gate insulation layer pattern.

Display substrates, methods of manufacturing the same and display devices including the same

A method of manufacturing a display substrate includes forming a gate insulation layer on the base substrate on which a gate metal pattern, forming a data metal pattern on the gate insulation layer, sequentially forming a insulation layer and an organic layer on the base substrate on which the data metal pattern is formed, partially exposing the organic layer, developing the organic layer to partially remove the organic layer on the data metal pattern and to expose at least a portion of the protecting layer on the gate metal pattern, forming a common electrode on the organic layer, forming a pixel electrode on the on the organic layer, and forming an insulation layer between the pixel electrode and the common electrode. An etching degree of a data metal may be controlled by controlling a thickness of a remained organic layer to reduce a damage of the data metal.

Display substrate and method of manufacturing the same

Exemplary embodiments of the present invention disclose a non-halogenated etchant for etching an indium oxide layer and a method of manufacturing a display substrate using the non-halogenated etchant, the non-halogenated etchant including nitric acid, sulfuric acid, a corrosion inhibitor including ammonium, a cyclic amine-based compound, and water.

Non-halogenated etchant and method of manufacturing a display substrate using the non-halogenated etchant

In a substrate fixing device and a method form manufacturing the substrate fixing device, the substrate fixing device includes a lower electrode, a dielectric layer and a plurality of protrusions. The dielectric layer is disposed on the lower electrode. The protrusions are spaced apart from each other, and are protruded from the dielectric layer. Each of the protrusions includes an insulating layer disposed on the dielectric layer, and an upper layer disposed on the insulating layer and contacting a substrate.

Substrate fixing device and method for manufacturing the same

Embodiments of the present invention relate to a thin film transistor and a manufacturing method of a display panel, and include forming a gate line including a gate electrode on a substrate, forming a gate insulating layer on the gate electrode, forming an intrinsic semiconductor on the gate insulating layer, forming an extrinsic semiconductor on the intrinsic semiconductor, forming a data line including a source electrode and a drain electrode on the extrinsic semiconductor, and plasma-treating a portion of the extrinsic semiconductor between the source electrode and the drain electrode to form a protection member and ohmic contacts on respective sides of the protection member. Accordingly, the process for etching the extrinsic semiconductor and forming an inorganic insulating layer for protecting the intrinsic semiconductor may be omitted such that the manufacturing process of the display panel may be simplified, manufacturing cost may be reduced, and productivity may be improved.

Method for manufacturing a display panel

A thin film transistor substrate includes a base substrate, an active pattern, a gate insulation pattern and a gate electrode. The active pattern is disposed on the base substrate. The active pattern includes a source electrode, a drain electrode, and a channel disposed between the source electrode and the drain electrode. The gate insulation pattern and the gate electrode overlap with the channel. The gate insulation pattern is disposed between the channel and the gate electrode. The source electrode and the drain electrode each include a fluorine deposition layer.

Thin film transistor substrate including a fluorine layer in an active pattern

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Seoul, South Korea

Sang-Gab Kim