Lg Chem, Ltd

Sang Eun Kim

Myung Han Lee

Hyun Sup Lee

Ki Soo Lee

Se Woo Yang

Yoon Gyung Cho

Ye Hoon Im

Sang Min Park

Kyung Yul Bae

Sang Hoon Lee

Hyemin Lee

Sung Hyun Park

Sang Jin Jeon

Hee Kwang Park

Sang Eun An

The present invention relates to a method for predicting the break-up possibility of a synthetic resin filament in a melt blowing process from the rheological properties of the synthetic resin. According to the present invention, a method that is capable of predicting the break-up possibility of the synthetic resin filament in the melt blowing process for preparing a filament using the synthetic resin in advance, through the measurement of the rheological properties of the synthetic resin, is provided.

Method for preparing a synthetic resin filament in a melt blowing process from rheological properties of the synthetic resin

The present application provides a pressure-sensitive adhesive film, an organic electronic device including the same and a method of manufacturing an organic electronic device using the same. The present application provides the pressure-sensitive adhesive film which forms a structure effectively blocking water or oxygen from penetrating into an organic electronic device from the outside, and has excellent mechanical properties such as handleability, formability or the like and transparency.

Pressure sensitive adhesive film

Growing community of inventors

Daejeon, South Korea

Sang Eun Kim