Samsung Electronics Co., Ltd.

Sungkyunkwan University

Sang-Eui Lee

Dong-earn Kim

Ha-Jin Kim

In-Taek Han

Yoon-chul Son

Min-jong Bae

Sung-hoon Park

Dong-ouk Kim

Kun-mo Chu

Sang-Soo Jee

Kyoung-Seok Moon

In Taek Han

Young-Chul Ko

Jin Kyu Kang

Kun Mo Chu

Jin Ho Ahn

Ha Jin Kim

Jooyoung Lee

Byungkwon Lim

Shingyu Bok

Hwansu Sim

Woo-Taek Hwang

Dong-Ouk Kim

Nayoung Kwon

Guh-Hwan Lim

Nak-Hyun Kim

Dong-Earn Kim

Min-Jong Bae

Kun-Mo Chu

Yoon-Chul Son

A magnetic sheet having a magnetic material particle comprising a hexaferrite and a nanofiber matrix made of two or more nanofibers, wherein the magnetic material particle is dispersed in the nanofiber matrix. A manufacturing method thereof and a speaker including the magnetic sheet are also provided.

Magnetic sheet, method of making the same, and loud speaker including the same

A heating composite, including a polymer matrix; and a carbon nanotube structure including a plurality of carbon nanotubes continuously connected to each other and integrated with the polymer matrix.

Heating composite, and heating apparatus and fusing apparatus including the same

A resistance heating composition including a silicon emulsion particle, a carbon nanotube, and an aqueous medium.

Resistance heating composition, heating composite using the composition, method of preparing the heating composite, and heating apparatus and fusing apparatus using the same

A resistance heating element includes a positive temperature coefficient resistance heating layer having a positive temperature coefficient, and a negative temperature coefficient resistance heating layer, which is connected to the positive temperature coefficient resistance heating layer and has a negative temperature coefficient.

Resistance heating element and heating member and fusing device employing the same

A heating member includes: a resistive heating layer which generates heat when supplied with electrical energy; a release layer as an outermost layer of the heating member and including a polymer; an intermediate layer disposed between the resistive heating layer and the release layer. The resistive heating layer includes a base polymer, and an electroconductive filler dispersed in the base polymer. The intermediate layer includes a polymer material being a same type as the base polymer of the resistive heating layer or the polymer of the release layer.

Heating member including a base polymer and fusing apparatus including the same

A method of forming a thin film resistive heating layer, the method including: forming a polymer layer by extruding a polymer paste, in which an electrically conductive filler is dispersed, by using an extrusion molding operation, on an outer circumferential surface of a cylindrical member; and forming a thin film resistive heating layer by making an outer diameter of the polymer layer uniform by using a ring blading operation.

Method of forming thin resistive heating layer, heating member including the thin resistive heating layer, and fusing unit including the heating member

A heating member includes a resistive heating layer disposed on an outermost layer of the heating member, where the resistive heating layer includes a conductive filler distributed in a base material and where the resistive heating layer emits heat when supplied with an electric current from an electrode, and a contacting unit which exposes the conductive filler of the resistive heating layer and contacts the electrode.

Heating member including resistive heating layer, and fusing apparatus and image forming apparatus including the heating member

A fusing device includes; a heating member having a resistive heating layer constituting an outermost portion of the heating member, a nip forming member facing the heating member to form a fusing nip therewith, and a plurality of current supplying electrodes which contact an outer circumference of the resistive heating layer to supply electrical current to the resistive heating layer.

Fusing device including resistive heating layer and image forming apparatus including the fusing device

Growing community of inventors

Hwaseong-si, South Korea

Sang-Eui Lee