Hynix Semiconductor Inc.

Sang-Do Lee

Dong-Goo Choi

Jin-Ho Yang

Dong-Ryeol Lee

Sun-Woong Na

A method for fabricating a capacitor includes forming a first storage node (SN) oxide layer over a substrate, forming a second SN oxide layer over the first SN oxide layer, forming a mask pattern over the second SN oxide layer, dry-etching the first and the second SN oxide layers using the mask pattern as an etch barrier to form a capacitor region, and wet-etching a resultant structure including the capacitor region to enlarge a bottom width of the capacitor region, thereby forming a final capacitor region having the enlarged bottom width, wherein the first SN oxide layer comprises one portion of high impurity concentration and the other portion of low impurity concentration, the one portion corresponding to a region where the final capacitor region is to be formed.

Method for fabricating capacitor

A method for fabricating a semiconductor device includes: providing a substrate structure including a bit line and a capacitor formed apart from each other at a different level; forming first, second, and third insulation layers over the bit line, the second insulation layer being a first etch stop layer; forming a second etch stop layer over a top electrode of the capacitor; forming a fourth insulation layer over the third insulation layer and the second etch stop layer; and performing a plurality of etch steps to expose an upper surface of the bit line and an upper surface of the capacitor.

Growing community of inventors

Kyoungki-do, South Korea

Sang-Do Lee