Samsung Electro-mechanics Co., Ltd.

Ls Electric Co., Ltd.

Sang-Chul Lee

Doo-hwan Lee

Je-Gwang Yoo

Sung Yi

Yul-Kyo Chung

Jae-Kul Lee

Hwa-sun Park

Won-Cheol Bae

Jin-Soo Jeong

Young Kim

Kyu-Ho Lee

Jong-Yun Lee

Sang-Jin Baek

Han-Baek Chung

Jong-Woon Kim

Seung-Pil Yang

The present disclosure provides an entrance and exit position detection device for a power device. The entrance and exit position detection device for a power device comprises: a cradle which is open on one side and has an arrangement space formed therein; a power device body which may be in the arrangement space and has a guide plate formed on one side portion thereof; and a position detection part which linearly detects the displaced position of the power device body while the cradle enters and exits the arrangement space. Also, the present disclosure provides an entrance and exit monitoring system which has the above-described entrance and exit position detection device for the power device.

Entrance and exit position detection device for power device, and entrance and exit monitoring system including same

An arc extinction apparatus according to an embodiment of the present disclosure comprises a chamber unit, a division unit, a filter unit, and a cover unit. A discharge port is formed in the chamber unit such that a fluid in the chamber unit is discharged to the outside. An insertion groove is provided on inner faces of the chamber unit that face each other. The division unit is coupled to the inside of the chamber unit. In addition, the division unit divides a path of the fluid discharged through the discharge port into multiple paths. The filter unit is disposed in the discharge port and filters out at least one predetermined material from the fluid passing through the discharge port. The cover unit comprises a plurality of exhaust pipes and is coupled to the discharge port from the outside of the filter unit.

Arc extinction apparatus of air circuit breaker

An electro device embedded printed circuit board and a manufacturing method thereof are disclosed. In accordance with an embodiment of the present invention, a printed circuit board embedded with an electro device, in which a pair of electrodes are formed on either end, includes: a core substrate in which a first cavity is formed; a first passive device embedded in the first cavity and being thinner than the core substrate; and a second passive device stacked on an upper side of the first passive device such that the second passive device is embedded in the first cavity. The first passive device and the second passive device are stacked to cross each other.

Electro device embedded printed circuit board and manufacturing method thereof

A component-embedded PCB and a method of manufacturing the PCB are disclosed. Using a method that includes perforating a cavity in a core substrate; inserting a component in the cavity; stacking a film layer over the core substrate; forming at least one post by selectively leaving behind the film layer in correspondence to a position of at least one electrode of the component; covering an insulation layer over the core substrate such that the post penetrates the insulation layer to be exposed at a surface of the insulation layer; and forming at least one via hole by removing the post, can provide increased precision and finer pitch. Also, since laser is not used when processing the vias, damage to the component that may occur due to the laser is prevented. Furthermore, tolerance defects may be decreased, as well as defects caused by residue left after processing.

Method of manufacturing a component-embedded PCB

A method of manufacturing a component-embedded printed circuit board is disclosed. The method includes: forming a blind hole in the first metal layer such that the first insulation layer is exposed, for a metal-clad laminate that includes a first metal layer stacked over a first insulation layer, securing a component to the first insulation layer by embedding the component in the blind hole, stacking a second insulation layer and a second metal layer on either side of the metal-clad laminate, and forming circuit patterns by removing portions of the metal layers.

Method of manufacturing component-embedded printed circuit board

Growing community of inventors

Anyang-si, South Korea

Sang-Chul Lee