Samsung Electronics Co., Ltd.

Samsung Sdi Co., Inc.

Cheil Industries Inc.

Sang Cheon Park

Hyuekjae Lee

Taehun Kim

Un-Byoung Kang

Dae-Woo Kim

Jihwan Hwang

Jihwan Suh

Hyoun Young Kim

Jin Woo Kim

Young Oh

Sanghoon Lee

Young Min Lee

Jeong Ho Lee

Jun Woo Lee

Chajea Jo

Seong Hoon Lee

Jonggi Kim

Taeje Cho

Young Hyun Ju

Mi Young Chae

Jinsuop Youn

Jong Hyuk Eun

Hyuek Jae Lee

Won Il Lee

Jinkyeong Seol

Hyunjoo Han

Onyou Park

Obum Kwon

Sungseo Cho

Chul Jin Park

Euihyun Kong

Heeje Woo

Moon Soo Choi

Gi Wook Kang

Gyu Cheol Lee

Keun Young Kim

A semiconductor package includes a redistribution substrate, a first memory chip provided on the redistribution substrate, the first memory chip comprising a first base layer, a first circuit layer provided on a top surface of the first base layer, and a first via penetrating the first base layer and connected to the first circuit layer and the redistribution substrate, a logic chip provided on the first memory chip, and a first molding layer surrounding the first memory chip. An outer side surface of the first molding layer is coplanar with a side surface of the logic chip. At an interface of the logic chip and the first memory chip, a first chip pad provided in the first circuit layer of the first memory chip and a second chip pad of the logic chip are formed of the same material and constitute one body.

Semiconductor package

A semiconductor package includes a substrate, a first semiconductor chip disposed on the substrate, and a second semiconductor chip disposed on a top surface of the first semiconductor chip. The first semiconductor chip includes a conductive pattern disposed on the top surface of the first semiconductor chip and a first protective layer covering the top surface of the first semiconductor chip and at least partially surrounds the conductive pattern. The second semiconductor chip includes a first pad that contacts a first through electrode on a bottom surface of the second semiconductor chip. A second protective layer surrounds the first pad and covers the bottom surface of the second semiconductor chip. A third protection layer fills a first recess defined in the second protective layer to face the inside of the second protective layer. The first protective layer and the third protective layer contact each other.

Stacked semiconductor package

A semiconductor package includes a substrate including a first semiconductor chip including a first wiring structure, a first bonding pad, and a first alignment key on the first wiring structure to be spaced apart in a first direction, a second semiconductor chip including a second wiring structure, a second bonding pad on the second wiring structure and connected to the first bonding pad, and a second alignment key on the second wiring structure to be spaced apart from the second bonding pad and not overlapping the first alignment key in the second direction, the first wiring structure including a first wiring pattern connected to the first bonding pad and not overlapping the first and second alignment keys in the second direction, and the second wiring structure including a second wiring pattern connected to the second bonding pad and not overlapping the first and second alignment keys in the second direction.

A semiconductor package is provided. The semiconductor package may include a first semiconductor die, a second semiconductor die stacked on the first semiconductor die, the second semiconductor die having a width smaller than a width of the first semiconductor die, a third semiconductor die stacked on the second semiconductor die, the third semiconductor die having a width smaller than the width of the first semiconductor die, and a mold layer covering side surfaces of the second and third semiconductor dies and a top surface of the first semiconductor die. The second semiconductor die may include a second through via, and the third semiconductor die may include a third conductive pad in contact with the second through via.

Semiconductor package including a pad contacting a via

Provided are quantum dots passivated by oligomers or polymers which are formed by a reaction of a first monomer having at least three thiol groups (&#x2014;SH) at the terminal end with a second monomer having at least two functional groups at the terminal end that can react with the thiol groups, and a spacer group between the at least two functional groups.

Quantum dot, composition comprising same, and method of manufacturing quantum dot

A semiconductor device includes a semiconductor chip having an active surface and a non-active surface opposite to the active surface, an upper insulating layer provided on the non-active surface of semiconductor chip, and a via and a connection pad penetrating the semiconductor chip and the upper insulating layer, respectively. The connection pad has a first surface exposed outside the upper insulating layer and a second surface opposite to the first surface and facing the semiconductor chip. The first surface of the connection pad is coplanar with an upper surface of the upper insulating layer.

Semiconductor device

A liquid crystal display module includes first and second polarizing plates, and a liquid crystal panel between the polarizing plates. The second polarizing plate comprises an optical film on a polarizer. The optical film comprises a high refractive index pattern layer having at least one engraved pattern, and a low refractive index pattern layer having a filling pattern that fills at least a portion of the engraved pattern. The high refractive index pattern layer has a higher refractive index than the low refractive index pattern layer. The optical film is disposed such that light emitted from the liquid crystal panel will enter the low refractive index pattern layer and then be emitted through the high refractive index pattern layer. A liquid crystal display includes the liquid crystal display module.

Liquid crystal display module and liquid crystal display comprising the same

The present invention relates to an optical film and an optical display apparatus including the same. The optical film may include a base film and an optical functional layer formed on the base film, wherein at least one of the base film. The optical functional layer may include a luminescent material, and the luminescent material may include at least one of a fluorescent material and a phosphorescent material.

Optical film and optical display device including same

A photocurable resin composition includes an ester (meth)acrylate, an antistatic agent, a silicone additive, an initiator, and at least one UV-curable unsaturated compound. The at least one UV-curable unsaturated compound may include a monofunctional or multifunctional UV-curable monomer, and a (meth)acrylate containing about 10 mol % or more of an ethylene oxide group.

Photocurable resin composition, method of fabricating optical film using the same, and optical film including the same

Growing community of inventors

Suwon-si, South Korea

Sang Cheon Park