Korea Research Institute of Chemical Technology

Electronics and Telecommunications Research Institute

Sang-Bong Lee

Jae-Rock Lee

Byeong-Thaek Oh

Hae-Ryong Lee

Kyu-Wan Lee

Tae-In Hwang

Moon-Ok Choi

Ho-Jin Park

Shin-Yuk Kang

Soon-Jin Park

A dynamic user interface (UI) system and method is provided for remote controlling of a legacy device, which is not compatible with a peer-to-peer (P2P) middleware, through a P2P network. The dynamic UI system of the present includes at least one legacy device, a proxy for registering and managing the at least one legacy device and supporting a dynamic remote control user interface using a multi legacy device control protocol, and an edge peer for downloading the dynamic remote control user interface from the proxy and requesting control of the at least one legacy device to the proxy.

Dynamic UI system and method for remotely controlling legacy device

A method for preparing a high-heat-resistant-epoxy-resin composition which comprises adding, as catalytic curing agent, a quinoxalinium salt having a benzyl group to difunctional and multifunctional epoxy resin and thermoset resin having a similar structure. The epoxy-resin composition obtained by the present invention is excellent in its impregnating property, processability, impact resistance, drug resistance, electric-insulating property, and adhesiveness.

Method for preparing a high heat resistant epoxy resin composition

A method for preparing a high-heat-resistant-epoxy-resin composition which comprises adding, as catalytic curing agent, a pyrazinium salt having a benzyl group to difunctional and multifunctional epoxy resin and thermoset resin having a similar structure. The epoxy-resin composition obtained by the present invention is excellent in its impregnating property, processability, impact resistance, drug resistance, electric-insulating property, and adhesiveness.

Method for preparing a high-heat-resistant-epoxy-resin composition

A heat-curable resin composition comprising a multifunctional epoxy resin monomer and a heat-latent curing agent of formula (I) provides a cured epoxy resin having good thermal and dimensional stability: ##STR1## wherein: R is hydrogen, a C.sub.1-4 alkyl or C.sub.1-4 alkoxy group.

Heat-curable epoxy resin composition

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Daejeon, South Korea

Sang-Bong Lee