Posco Co., Ltd

Sang-Bae Lim

Won-Hwi Lee

Jin-Ho Jung

The present invention relates to a solution for electroplating iron, comprising: iron ions comprising first iron ions and second iron ions; a complexing agent; and unavoidable impurities, wherein the amount of second iron ions among the iron ions is 5 to 60 wt %. According to the present invention, electroplating efficiency is high, there is no drop in electroplating efficiency due to a continuous plating operation, and sludge generation is prevented, and, thus, the plating solution is easily managed. Burning can be prevented even in a high current density operation, and, thus, a high-quality iron-plated layer can be achieved. The plating solution does not need to be replaced, as the concentration of second iron ions generated by a plating reaction is maintained to be constant, and, thus, the present invention is appropriate for a continuous plating process.

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Gwangyang-si, South Korea

Sang-Bae Lim