Mitsubishi Heavy Industries Limited

Technology Research Association for Future Additive Manufacturing

Saneyuki Goya

Toshiya Watanabe

Minoru Danno

Takashi Ishide

Yoshihito Fujita

Akiko Inoue

Satoshi Sakai

Masato Kinouchi

Ryuichi Narita

Masahiko Shimizu

Kazuhiro Yoshida

Yasuyuki Fujiya

Makoto Yamasaki

Yoshinao Komatsu

Tsugumaru Yamashita

Ryu Suzuki

Kohei Kanaoka

Ryota Ozaki

Hiroki Mori

Hitoshi Sakamoto

Kengo Yamaguchi

Kenji Muta

Hiroshi Mashima

Haruhiko Niitani

Shigenori Tsuruga

Toshihiko Nishimori

Tatsuyuki Nishimiya

Yuki Kani

Noriaki Ueda

Christian Freitag

Atsushi Takita

Eishiro Sasakawa

Hiroomi Miyahara

Youji Nakano

Kouji Satake

Rudolf Weber

Ehsan Zahedi

Takao Abe

A laser machining device includes: a laser irradiation unit that forms a machining groove that has one end opening to an end section of a workpiece and the other end thereof closed, as a result of scanning a workpiece surface from an end section of the workpiece and laser machining the workpiece; and a nozzle unit that sprays a gas across an irradiation zone of the workpiece surface created by the laser irradiation unit. The nozzle unit is configured so as to increase the flowrate of the gas supplied to the irradiation zone, from one end to the other end of the machining groove.

Laser machining device

This laser processing device is provided with a laser radiating unit which forms a processed groove extending in a scanning direction on a workpiece, by subjecting the workpiece to laser processing while scanning the surface of the workpiece, and a nozzle portion which has a plurality of ejection holes arranged side by side in the scanning direction, and which ejects a gas toward the processed groove from each of the ejection holes. With this laser processing device, since a plume is eliminated by ejecting gas into the processed groove by means of the nozzle portion, the formation of a heat affected layer by the plume can be suppressed to an even greater extent.

Laser processing device

A laser processing system and a laser processing method that reduce irregularities on a cutting surface caused by a variation in a heat affected zone or a difference in the heat affected zone due to processing by a laser beam. The laser processing system is provided with: a laser processing device that scans a composite material containing reinforced fibers and a resin with a laser beam to process the composite material; and a control device that controls the laser processing device. The control device calculates a scanning angle formed by a fiber direction that is a direction of the reinforced fibers and a scanning direction that is a direction in which the laser beam is caused to scan, calculates a scanning condition of the laser beam on the basis of the calculated scanning angle, and controls scanning of the laser beam on the basis of the calculated scanning condition.

Laser processing system and laser processing method based on direction of reinforced fiber

A laser machining method performing cutting machining to cut a composite material over a thickness direction thereof by applying a laser beam to the composite material. The method includes applying the laser beam from one side in the thickness direction of the composite material so as to form a first cutout in the composite material; and applying the laser beam from the other side in the thickness direction of the composite material, forming a second cutout in the composite material at a position opposing the first cutout, connecting the second cutout to the first cutout, and cutting the composite material. The first cutout is formed by applying the laser beam through a plurality of machining paths arranged in the width direction of the first cutout. The second cutout is formed by applying the laser beam through a plurality of machining paths arranged in the width direction of the second cutout.

Laser machining method and laser machining device

A laser processing method includes a first step of irradiating a surface of a composite material with a laser to form a hole processing groove on the composite material by scanning first paths from an outside corresponding to an inner peripheral surface side of a through hole to be formed to an inside corresponding to a center side of the through hole to be formed, the first paths extending across a width direction of the hole processing groove; and a second step of irradiating and penetrating through the hole processing groove with the laser to form the through hole by scanning second paths from the outside to the inside after the first step, the second paths extending across the width direction of the hole processing groove. The laser used at the first step has a smaller heat input amount per unit time than the laser used at the second step.

Laser processing method and laser processing apparatus

Provided are a machining device (), a machining unit, and a machining method that irradiate a workpiece () with a laser beam to perform cutting or boring machining of the workpiece (). The invention has a laser output device (), a guiding optical system () that guides a laser beam, and an irradiating head () that guides a laser beam and irradiates the workpiece () with the laser beam. The irradiating head () integrally rotates a first prism () and a second prism () with a rotation mechanism, thereby rotating a light path of the laser beam around a rotational axis of the rotation mechanism and irradiating the workpiece () while rotating the position of irradiation to the workpiece. A control device () calculates an allowable rotational frequency range of the laser beam on the basis of the relationship between an allowable thickness of a remelted layer of the workpiece () and a rotational frequency, or the relationship between an allowable thickness of an oxidization layer of the workpiece and the rotational frequency, determines a rotational frequency included in the allowable rotational frequency range as the rotational frequency of the rotation mechanism, and rotates the rotation mechanism at the determined rotational frequency, thereby enabling high-precision machining to be performed with a simple configuration.

Machining device, machining unit, and machining method

A laser machining device includes a laser machining head and a control unit. The laser machining head applies laser for machining an object to be machined, and includes a first laser light source for first laser, a second laser light source for second laser having a different pulse width different from the first laser, a condensing optical system provided between the object and the laser light sources to condense at least the lasers on the object, a switch mechanism provided between the condensing optical system and the laser light sources so that the switch mechanism is movable to a position that at least one of the lasers enters the condensing optical system, and an irradiation angle change mechanism provided between the condensing optical system and the switch mechanism to change an irradiation angle of the first laser. The control unit controls the laser machining head.

Laser machining device and laser machining method

Provided is a laser processing method in which a laser processing head for irradiating, with at least a short-pulse laser, a processed article having a protection layer laminated to a metal layer is used to process the processed article, whereby high-quality, highly accurate processing is possible by means of a short-pulse laser processing step for irradiating the protection layer with the short-pulse laser and ablating the protection layer, and a metal layer processing step for ablating the metal layer in the area that was ablated during the short-pulse laser processing step.

Provided are a processing device and a processing method with which the device can be made more compact, and with which highly precise processing can be performed. The processing device, which processes a member to be processed by irradiating the member to be processed with a laser, has: a laser oscillator having a plurality of vertical cavity surface-emitting laser diode chips that output laser light having a wavelength of 1,070 nm or less, and a substrate on the surface of which the plurality of vertical cavity surface-emitting laser diode chips are arranged in a matrix; a guidance optical system that guides the laser light output from the laser oscillator; and a control device that controls the output of the laser oscillator.

Processing device and processing method

This invention is directed to attenuating a beam output without changing the beam position and the beam diameter. A high-output optical attenuator includes a first reflector that totally reflects incident light and causes first reflected light serving as reflected light of the incident light to enter a second reflecting portion, a second reflector that reflects the first reflected light and causes second reflected light serving as reflected light of the first reflected light to enter a third reflecting portion, a third reflector that reflects the second reflected light and causes third reflected light serving as reflected light of the second reflected light to enter a fourth reflecting portion, and a fourth reflector that reflects the third reflected light as fourth reflected light having the same optical axis as the optical axis of the incident light. At least two of the second reflector, the third reflector, and the fourth reflector are half mirrors.

High-output optical attenuator, measurement device, and 3D shaping apparatus

This invention is directed to reliably condensing weak light by a sensor arranged at a position spaced apart from a processing position. The optical processing head includes a light guide that guides light for irradiating a processing position. The optical processing head further includes a light transmitter that has one end arranged near the distal end of the light guide and the other end connected to a photodetector, condenses reflected light traveling from the processing position, and transmits it to the photodetector. The optical processing head includes at least one light transmitter as its feature.

Optical processing head having a plurality of optical fibers arranged to surround the light guide and 3D shaping apparatus

A processing apparatus and a processing method which perform processing more accurately with a simple structure are provided. The processing apparatus includes an irradiation headand a control device. The irradiation headincludes a laser turning unitand a condensing optical system. The laser turning unitincludes a first prism, a second prism, a first rotating mechanism, and a second rotating mechanism. The control device adjusts the differences between rotation speeds and phase angles of the first prismand the second prismbased on a relation between at least a heat affected layer of a workpiece and a turning speed of laser.

Processing apparatus and processing method

Provided are a machining device and a machining method in which machining of higher precision can be performed with a simple configuration. The machining device has an irradiation head () and a controller; and the irradiation head () can be divided into a collimate optical system, a laser revolving unit (), and a light collection optical system (). The laser revolving unit () has a first prism (), a second prism (), a first rotation mechanism (), and a second rotation mechanism (). The controller controls the rotational speeds and the difference in phase angles of the first prism () and the second prism (), on the basis of at least the relationship between a heat affected layer of a member to be machined and the revolving speed of the laser.

Machining device and machining method

A photovoltaic device that exhibits increased open-circuit voltage and an improved fill factor due to an improvement in the contact properties between the n-layer and a back-side transparent electrode layer or intermediate contact layer, and a process for producing the photovoltaic device. The photovoltaic device comprises a photovoltaic layer having a p-layer, an i-layer and an n-layer stacked on top of a substrate, wherein the n-layer comprises a nitrogen-containing n-layer and an interface treatment layer formed on the opposite surface of the nitrogen-containing n-layer to the substrate, the nitrogen-containing n-layer comprises nitrogen atoms at an atomic concentration of not less than 1% and not more than 20%, and has a crystallization ratio of not less than 0 but less than 3, and the interface treatment layer has a crystallization ratio of not less than 1 and not more than 6.

Photovoltaic device and process for producing photovoltaic device

A photovoltaic device having a high conversion efficiency is produced in a stable manner. The conditions for film deposition of a microcrystalline silicon photovoltaic layer () in a photovoltaic device are set based on the Raman peak ratio within a Raman spectrum obtained at the substrate () side of the microcrystalline silicon layer (), and the Raman peak ratio within a Raman spectrum obtained at the opposite side to the substrate ().

Growing community of inventors

Tokyo, Japan

Saneyuki Goya