Mitsui Petrochemical Industries, Ltd.

Yazaki Corporation

Sanehiro Yamamoto

Akinori Toyota

Fumitoshi Ikejiri

Toshio Kimura

Takasi Nakagawa

Yoshikatsu Amimoto

Tetsuo Kato

Masahiro Kanda

Kazuto Sugiyama

Fujihisa Matsunaga

Hideki Sakai

Michio Tanaka

Mitsuki Yasuhara

Keiji Kawamoto

Masahiro Kondo

Yoshito Kurano

Kazuo Ishiwatari

Masato Kawamura

Katunari Nishimura

Mitsunori Nakamura

Hirotaka Aso

Masato Okano

The thermoplastic resin composition of the present invention comprises (A) polyamide having a melting point of not lower than 280.degree. C., particularly preferably (A-1) specific polyamide having a melting point of higher than 300.degree. C., (B) a specific modified polymer, (C) a hindered phenol type antioxidant having a molecular weight of not less than 500 and a TGA 10% weight loss temperature of not lower than 300.degree. C., and (D) a sulfur type antioxidant having a molecular weight of not less than 600 and a TGA 10% weight loss temperature of not lower than 280.degree. C. The molded product of the present invention is made of the above-mentioned thermoplastic resin composition. The thermoplastic resin composition of the invention is excellent in heat stability.

Thermoplastic resin composition and molded product thereof

The cycloolefin resin compositions of the present invention comprise:

Cycloolefin resin composition

The cycloolefin resin compositions of the present invention comprise: [A] cycloolefin resin selected from (a-1) a cycloolefin random copolymer having recurring units derived from a cycloolefin of a specific structure, (a-2) a ring opening (co)polymer of the cycloolefin, (a-3) a hydrogenation product of the ring opening (co)polymer and (a-4) a graft-modified product of the random copolymer (a-1), the ring opening (co)polymer (a-2) and the hydrogenation product thereof (a-3); [B] at least one of (b-1) an unmodified elastomer, (b-2) a modified elastomer, (b-3) an unmodified crystalline polyolefin and (b-4) a modified crystalline polyolefin; and [C] a polyamide resin. Molded products formed from these cycloolefin resin compositions are excellent particularly in resistance to greases.

Disclosed is a thermoplastic resin composition comprising

Thermoplastic resin composition and use thereof

The resin composition for forming plated layer disclosed herein comprises a polyamide composed of a dicarboxylic acid component recuring unit and a recurring unit derived from a diamine component unit having an alkylene group of 4 to 25 carbon atoms and at least one inorganic filler. There are also disclosed the resin molded article having plated layer formed thereon, the electromagnetic wave shielding material, the decorative resin molded article and the connecting material produced by forming plated layer on the surfaces of the resin molded articles formed from said resin composition. Further, there is disclosed the printed circuit board produced by forming selectively metallized layer in wiring circuit portion on the surface of the resin molded article formed from said resin composition and the method for plating to form these articles having the layer plated thereon.

Resin composition for forming plated layer and use thereof

The resin composition of the invention comprises as resin components specific aromatic polyamide (A), a specific graft-modified polymer (B), an aliphatic polyamide (C), and plural antioxidants comprising a hindered phenol type antioxidant (D) having a molecular weight of not less than 500 and a TGA 10% weight loss temperature of not lower than 300.degree. C. and a sulfur type antioxidant (E) having a molecular weight of not less than 600 and a TGA 10% weight loss temperature of not lower than 280.degree. C. The connector of the invention has housing formed from the above-mentioned resin composition. The resin composition of the invention shows excellent heat resistance. The connector of the invention is lightweight and is excellent in heat resistance, water resistance and chemical resistance.

Polyamide resin composition and connector

The present invention provides resin compositions containing thermoplastic resins. Thermoplastic resins employable for the compositions are polyolefin resins, polyester resins, polystyrene resins, polyamide resins and polyphenylene ether resins. The present invention can be particularly effected by using polyamide, particularly, specific aromatic polyamides. In the present invention, the resin compositions can be improved in various chemical and physical properties such as flame-retardance, moldability, color tone, heat stability, mechanical strength by the use of other resin component and stabilizers such as halogenated organic compounds, modified polyolefins, antimony compounds, phosphorus-containing compounds, amine- or phosphorus-type stabilizers.

Flame retardant polyamide thermoplastic resin composition

N-alkyl amino phenols, such as N-ethyl-m-amino phenol are produced in high yield and with high purity by reacting a divalent phenol, such as resorcinol, with an alkylamine, such as ethylamine, in the absence of catalyst and solvent, at a temperature of 120.degree.-210.degree. C. under elevated pressure in an inert gas atmosphere. In a first embodiment, the resulting reaction mixture is acidified to convert the N-alkylaminophenol to its water soluble salt and the resulting aqueous layer is separated from the oily layer. The aqueous layer is rendered alkaline to liberate N-alkylaminophenol as an oily layer. The N-alkyl-aminophenol oily layer is then separated from the aqueous layer and distilled. In an alternative embodiment, the reaction mixture resulting from the reaction between the divalent phenol and alkylamine is combined with an aqueous solution of an alkali to convert unreacted phenol to its water soluble salt while the product N-alkylaminophenol remains in an oily phase which is separated from the aqueous phase. An organic solvent is used as an extractant. The recovered N-alkylaminophenol organic solution is then distilled to recover N-alkylaminophenol. Purities of the recovered N-alkylaminophenol in excess of 95% can be achieved.

Method of producing N-alkylaminophenols

Process for preparing 2-unsubstituted imidazoles

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Yamaguchi, Japan

Sanehiro Yamamoto