Semikron Elektronik Gmbh &co.kg

Semikron Danfoss Elektronik Gmbh & Co., Kg

Sandro Bulovic

Ingo Bogen

Peter Beckedahl

Juergen Steger

Roland Bittner

Johannes Klier

Harald Kobolla

Alexander Wehner

Peter Lemke

Markus Beck

Markus Müller

Christian Zeiler

Thomas Götze

Bernd Fischer

An electronic power converter is in a housing of a power converter arrangement. A cooling duct for cooling the power converter with a cooling liquid is inside the housing. The cooling duct has a connection supplying the cooling liquid to the cooling duct and for discharging. Mating connections are connected to the connections of the cooling duct. The connections and the mating connections have sealing surfaces which face each other. The interior of the housing and the cooling duct is sealed via sealing devices each have two sealing rings spaced apart from each other. First sealing rings seal the cooling duct and the other sealing rings seal the housing. Annular grooves as outflow ducts in the housing lead off and open out on the outside of the housing and are introduced into the sealing surfaces in the region between the sealing rings.

Power converter arrangement

A power semiconductor arrangement has a switching facility, a housing, having a load connection facility for connecting in an electrically conductive manner to an external supply line and having a first plug-in connecting facility for plug-in connecting to an external second plug-in connecting facility. The housing has a first opening through which a connecting facility for connecting the load connection facility and the associated external supply line is accessible. A cover facility for covering the first opening is on the housing so as to be mechanically movable from a first end position into a second end position and has a first locking facility which cooperates with the external second plug-in connecting facility, whereby the first opening is closed with the cover facility as long as it is in its first end position, as long as the external second plug-in connecting facility is inserted into the first plug-in connecting facility.

Power semiconductor arrangement having a cover facility and method for releasing it

A power electronics system has a housing, a cooling device, a power semiconductor module and a capacitor device. The cooling device has a first and a second main surface. The power semiconductor module is arranged on the first main surface and is in thermally conducting contact with the cooling device and the capacitor device is arranged on the second main surface and is in thermally conducting contact with the cooling device. At least one DC connection device is connected to a DC module connection of the power semiconductor module and has a first cooling section, which is in thermally conducting contact with the cooling device.

Power electronics system having a housing, a cooling device, a power semiconductor module and a capacitor device

A power semiconductor module contains a power semiconductor assembly, a housing which in a housing side with an outer surface has a recess with a direction of passage in the normal direction of the outer surface, having an internal contact device which has an electrically conducting contact inside the housing to an external connection element, designed as a load terminal element, with one section in the recess and having a spring element. The connection element is designed as a rigid metallic shaped body with an inner and an outer contact surface, and the outer contact surface is accessible from the outside, and the connection element is connected to the housing via an electrically insulating and mechanically elastic retaining device such that the connection element is moveable in the direction of passage, and wherein the spring element is arranged and designed in such a way that the spring action thereof acts directly or indirectly on the connection element in the direction of passage.

Power semiconductor module and method for arranging said power semiconductor module

A power electronics system has a housing, a cooling device, a power semiconductor module and a capacitor device, wherein a cooling section of a capacitor connection device is in thermally conducting contact with a cooling surface of the cooling device.

Power module

The invention presents a power electronic arrangement comprising a power electronic switching device, a printed circuit board for carrying control signals for driving the power electronic switching device, a housing which covers the printed circuit board, a communication device which is arranged on the printed circuit board and is accessible through a recess in the housing, and comprising a sealing device, wherein the sealing device has a sealing section which rests in a sealing manner on a first sealing face of the communication device, and wherein the sealing device has a first and second sealing lip which are each arranged circumferentially around and at a distance from the communication device, wherein the two sealing lips are connected to one another by a web and both rest on a second sealing face of the printed circuit board, and wherein the housing has a wall-like pressure device which presses on the web and in this way the first sealing lip bears against that side of the pressure device which faces the communication device, and the second sealing lip bears against that side of the pressure device which is averted from the communication device.

Growing community of inventors

Langenzenn, Germany

Sandro Bulovic