Knowles Electronics, Inc.

Sandra Vos

John Szczech

Daniel Giesecke

Sung Bok Lee

Peter V Loeppert

Peter Van Kessel

Ryan McCall

Michael Kuntzman

Charles William King

Wade Conklin

William A Ryan

Jose Salazar

Yu Du

An acoustic device including a motor disposed in a housing having a non-porous elastomeric membrane disposed across an acoustic path defined by a sound port of the housing is disclosed. The motor may be embodied as MEMS transducer configured to generate an electrical signal responsive to an acoustic signal, or as some other electromechanical device. The membrane has a compliance that is 1 to 100 times a compliance of the acoustic device without the membrane, wherein the membrane prevents ingress of contaminants (e.g., solids, liquids or light) via the sound port while permitting propagation of the acoustic signal along the acoustic path without significant loss.

Acoustic assembly having an acoustically permeable membrane

A microphone device comprises a base, a port formed in the base, a cover attached to the base that forms a housing interior with the base, an MEMS element disposed in the housing interior and on top of the port, and an integrated circuit stacked on top of the MEMS element. The MEMS element includes a diaphragm and a backplate opposing the diaphragm. The integrated circuit includes an active surface and a substrate supporting the active surface. Circuitry and/or connectors are formed on the active surface for processing signals produced by the MEMS element. The substrate faces the MEMS element.

Stacked chip microphone

A Microelectromechanical system (MEMS) assembly includes a substrate, lid, MEMS device, and at least one wall. The substrate has electrical connection pads and the electrical connection pads are coupled to electrical conductors extending through the substrate. The MEMS device is attached to the lid. The at least one wall is coupled to the lid and the substrate and is formed separately from the lid and has an electrical conduit disposed therein. The electrical conduit is electrically coupled to the electrical conductors on the substrate. The electrical conduit and electrical conductors form an electrical path between the MEMS device and the electrical connection pads.

MEMS apparatus disposed on assembly lid

A Microelectromechanical System (MEMS) microphone includes a base printed circuit board (PCB), the base PCB having customer pads; at least one wall coupled to the base; a lid PCB coupled to the at least wall, the lid having a port extending there through; an electrically conductive through-hole via extending through the wall electrically connecting the lid PCB to the base PCB; an integrated circuit embedded in the lid and coupled to the electrically conductive through-hole via; and a micro electro mechanical system (MEMS) device coupled to the integrated circuit in the lid and disposed over the port. Sound energy is converted to an electrical signal by the MEMS device and transmitted to the integrated circuit. The integrated circuit processes the signals and sends the processed signals to the customer pads via the electrically conductive through-hole via.

Embedded circuit in a MEMS device

A micro-electro-mechanical system (MEMS) microphone includes a rectangular substrate with a rigid base layer, a first metal layer, a second metal layer, one or more electrical pathways, an acoustic port, and a patterned flexible printed circuit board material. The MEMS microphone also includes a MEMS microphone die and a solid single-piece rectangular cover.

Microphone assembly with barrier to prevent contaminant infiltration

A microphone assembly includes a cover, a base coupled to the cover, a microelectromechanical system (MEMS) device disposed on the base. An opening is formed in the base and the MEMS device is disposed over the opening. The base includes a barrier that extends across the opening and is porous to sound. The remaining portions of the base do not extend across the opening.

A Microelectromechanical System (MEMS) microphone includes a printed circuit board, a MEMS die, and an integrated circuit. The MEMS die is disposed on a top surface of the printed circuit board. The integrated circuit is disposed at least partially within the printed circuit board and produces at least one output signal. The output signals of the integrated circuit are routed directly into at least one conductor to access pads at the printed circuit board and the access pads are disposed on a bottom surface of the printed circuit board that is opposite the top surface.

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East Dundee, IL, United States of America

Sandra Vos