Valeo Etudes Electroniques

Valeo Equipements Electriques Moteur

Sandra Dimelli

Jean-Michel Morelle

Laurent Vivet

Mathieu Medina

Laurent Deneu-Fontaine

Romaric Lenoir

Ky Lim Tan

Stéphane Thomelin

Patrick Dubus

Hérve Lorin

Hervé Lorin

A device for assembling an element on a surface of a substrate by providing a solder-forming mass. The device has a means for moving the element and a measurement means. The means for moving the element includes a support and an element gripper member. The gripper member has a vertical axis that is perpendicular to the surface of the substrate and is mounted to move freely in translation on the support in a direction parallel to its vertical axis. The measurement means measures a variation of the position of the element in vertical translation.

Device for assembling a chip on a substrate by providing a solder-forming mass

In this method, a vertical stack is formed on an axis coinciding substantially with the gravity direction and comprising, from top to bottom: the element; the mass in a solid state; and the substrate. The mass is then heated so as to cause it to pass into a liquid state enabling it to spread on the substrate. More particularly, after the stack has been formed, the element is left free to move vertically, and during heating, variation in the vertical position of the element is measured.

Method for assembling a chip on a substrate

Said electronic power module () includes: a stack () comprising a metal layer forming an electric circuit () and intended for supporting an electronic power component () such as a semiconductor; a metal body forming a heat drain (); and a dielectric material layer () forming an electric insulator and inserted between the electric circuit () and the heat drain (). The stack () includes a composite material body () having a carbon-charged metal matrix. The carbon charge is between 20 and 60 volume percent. Said composite body () is inserted between an area of the electric circuit () and the electric insulator (), said area being intended for supporting the electronic power component ().

Electronic power module, and method for manufacturing said module

A method having a step of heating a mass forming a braze. Before the heating step, the method includes steps of arranging the mass and the member on the support. In particular, it includes a step of positioning the mass on the support and a step of applying a first compressive force on the mass so as to compress said mass against the support, the intensity of the first force increasing up to a predetermined first value chosen so as to flatten the mass. Next, the method includes a step of positioning the member on the flattened mass and a step of applying a second compressive force to the member so as to compress said member against the flattened mass and the support, the intensity of the second force increasing up to a second predefined value, the second predefined value being lower than the first predefined value.

Method of bonding a member to a support by addition of material, and device for arranging two elements, one on the other

The invention relates to a power module (), preferably for a vehicle, in particular an electric vehicle, characterized in that said module includes two vertically adjacent semiconducting chips (), each chip having a first surface () to be connected to a heat sink substrate (), and a second surface () separate from the first and on which at least one electronic component (-) is arranged, the module being arranged such that the second surfaces of the chips are arranged opposite one another.

Power module for an automobile

In this method, the conductive powder mass is placed on the support, and then the member is placed on the mass and a compression force is applied, urging the member against the mass and the support before heating the mass. The magnitude is increased from an initial value to a first predefined value for agglomerating the mass, which value is less than a plastic deformation threshold of the powder mass. Then, the magnitude is maintained at the first predefined value throughout a predetermined duration for agglomerating the powder mass. Finally, the magnitude is increased from the first value to a second predefined value less than a critical threshold for damaging the member but greater than a minimum threshold for sintering the mass at the predetermined temperature, the second predefined value being greater than the first predefined value.

Growing community of inventors

Bois d'Arcy, France

Sandra Dimelli