Applied Materials, Inc.

Sandesh Yadamane

Jallepally Ravi

Manjunatha P Koppa

Zubin Huang

Shreyas Patil Shanthaveeraswamy

Srinivas Tokur Mohana

Dien-Yeh Wu

Harpreet Singh

Yu Lei

Yi Xu

Mehran Behdjat

Kai Wu

Xiaoxiong Yuan

Pingyan Lei

Peiqi Wang

Geraldine M Vasquez

Vinod Konda Purathe

Xiaozhou Yu

Ambarish Toorihal

Process chamber shower head

Process chamber manifold

Embodiments of the disclosure provided herein generally relate to a bottom cover plate (BCP) that enables control of radiation loss from a heating element inside a chamber for processing a substrate. The heating element is used to heat the substrate before or during processing and may heat the substrate unevenly due to uneven heat losses within the chamber. For example, the uneven heating of the substrate may result in uneven deposition of a material on the substrate, which may result in excess processing to correct the deposition or wasted product from disposing of improperly processed substrates. The BCP may be used to correct the uneven heating of the substrate.

Bottom cover plate to reduce wafer planar nonuniformity

Embodiments of a lid heater for a deposition chamber are provided herein. In some embodiments, a lid heater for a deposition chamber includes a ceramic heater body having a first side opposite a second side, wherein the ceramic heater body includes a first plurality of gas channels extending from one or more first gas inlets on the first side, wherein each of the one or more first gas inlets extend to a plurality of first gas outlets on the second side; a heating element embedded in the ceramic heater body; and an RF electrode embedded in the ceramic heater body proximate the second side, wherein the first plurality of gas channels extend through the RF electrode.

Gas distribution ceramic heater for deposition chamber

Shadow ring lift pin

Shadow ring lift assembly

Shadow ring lift plate

Growing community of inventors

Bengaluru, India

Sandesh Yadamane