Koninklijke Philips Corporation N.v.

Lumileds LLC

Sander Petrus Martinus Noijen

Marc Andre De Samber

Norbertus Antonius Maria Sweegers

Gerard Kums

Roy Antoin Bastiaan Engelen

A mounting assembly () is disclosed for mounting and connecting an electrical device, in particular a light emitting diode. The mounting assembly () comprises a mounting element () including at least two metal layers () each having a top surface () and a bottom surface (). Top contact pads are formed at the top surface of each of the metal layers for providing a planar electrical and thermal contact to the electrical device. Bottom contact pads are formed at the bottom surface of each of the metal layers for providing a planar electrical and thermal contact to a mounting board ().

Mounting assembly and lighting device

A solid state light emitting device includes a light emitting stack (), a metallization (), comprising a guard layer () of metal, and a dielectric layer () over the guard layer () of the metallization. During subsequent processing delamination and/or cracking may occur at the edges of the devices, sometimes referred to as die edge defects. To address these defects a plurality of stress-relief elements () and/or anchor elements may be provided in an edge region of the metallization and/or dielectric layer for reducing delamination. The stress-relief elements () are formed by regions of reduced thickness or increased thickness in the guard layer ().

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Geldrop, Netherlands

Sander Petrus Martinus Noijen