General Electric Company

Momentive Performance Materials Gmbh

Sandeep Shrikant Tonapi

Ryan Christopher Mills

John Robert Campbell

Slawomir Rubinsztajn

Ananth Prabhakumar

Arun Virupaksha Gowda

Joseph James Lacey

William Edward Burdick, Jr

Ashutosh Joshi

Jian Zhang

Raymond Albert Fillion

David Richard Esler

Paulo Meneghetti

Davide Louis Simone

Hong Zhong

Gregory W Shaffer

Paul Joseph Hans

Laurence Maniccia

Stephen Andrew Latham

Jennifer David

Hollister Victor

Sara Naomi Paisner

Robert Fortuna

Gregory A Strosaker

A cure catalyst is provided. The cure catalyst may include a Lewis acid and one or both of a nitrogen-containing molecule or a non-tertiary phosphine. The nitrogen-containing molecule may include a mono amine or a heterocyclic aromatic organic compound. A curable composition may include the cure catalyst. An electronic device may include the curable composition. Methods associated with the foregoing are provided also.

Cure catalyst, composition, electronic device and associated method

A method for making a thermal interface structure is provided. The method may include disposing a thermal transport layer on a resin layer to form a stacked structure, and slicing the stacked structure to form a cross-sectional slice having a first exposed portion of the thermal transport layer on a first surface of the slice, and a second exposed portion of the thermal transport layer on the second surface of the slice.

Thermal management system and associated method

Thermal interface compositions contain both non-electrically conductive micron-sized fillers and electrically conductive nanoparticles blended with a polymer matrix. Such compositions increase the bulk thermal conductivity of the polymer composites as well as decrease thermal interfacial resistances that exist between thermal interface materials and the corresponding mating surfaces. Such compositions are electrically non-conductive. Formulations containing nanoparticles also show less phase separation of micron-sized particles than formulations without nanoparticles.

Thermal conductive material utilizing electrically conductive nanoparticles

A thermal transport structure having a thermal transport layer and a resin layer is provided. The thermal transport layer may include a first surface and a second surface, and having a thermally conductive material disposed in the thermal transport layer, where the thermally conductive material is oriented in a predetermined direction in order to facilitate heat conduction relative to the predetermined direction. Further, the resin layer is secured to the thermal transport layer second surface, where the resin layer is relatively less thermally conductive than the thermal transport layer.

Thermal transport structure and associated method

An underfill composition with enhanced adhesion and improved resistance to cracking comprising an epoxy resin in combination with a difunctional siloxane anhydride epoxy hardener and optional reagents. In some embodiments, the epoxy resin includes a functionalized colloidal silica filler having a particle size ranging from about 1 nm to about 500 nm. The difunctional siloxane anhydride epoxy hardener can optionally be combined with liquid anhydride epoxy hardeners. Cure catalysts, hydroxyl-containing monomers, adhesion promoters, flame retardants and defoaming agents may also be added to the composition. Further embodiments of the present disclosure include packaged solid state devices comprising the underfill compositions.

Underfill composition and packaged solid state device

A computed tomography (CT) system comprises an X-ray radiation source to project a plurality of X-ray beams through an object. A detector array comprises a plurality of detector assemblies. A gantry secured to the X-ray radiation source and the detector array rotates around a longitudinal axis. Further, each of the detector assembly comprises a detector subassembly adapted to detect the X-ray beams. These detector subassemblies are further adapted to convert the X-ray beams to a plurality of electrical signals. At least one circuit board assembly is coupled to the detector subassembly. The circuit board assembly typically comprises an integrated circuit array, such as, data acquisition chip array to acquire data corresponding to the electrical signals. The integrated circuit array further comprises a plurality of integrated circuit chips, for example, data acquisition chips mounted on at least one printed circuit board. A thermal management system is adapted for thermal communication between the data acquisition chip array and a heat sink assembly to control the thermal environment of each detector assembly. A processor is typically configured to process the electrical signals to generate a plurality of projection measurements. The processor is further adapted to perform computations on the projection measurements to construct an image of the object therefrom.

Detector assembly thermal management system and method

A composition for use as underfill material is provided. The underfill material includes a first curable transparent resin composition and a second curable fluxing resin composition. The first curable resin composition includes at least one aromatic epoxy resin in combination with a solvent, a functionalized colloidal silica dispersion, and at least one other component selected from the group consisting of cycloaliphatic epoxy monomers, aliphatic epoxy monomers, hydroxy aromatic compounds and combinations and mixtures thereof, thereby forming a solvent-modified resin. The second curable fluxing composition includes at least one epoxy resin. The combination of the two resin compositions is useful in producing underfill materials and is suitable for use as an encapsulant for electronic chips.

Combinations of resin compositions and methods of use thereof

A computed tomography (CT) system comprises an X-ray radiation source to project a plurality of X-ray beams through an object and a detector array comprising a plurality of detector assemblies. Each of the detector assembly further comprises a detector subassembly adapted to detect the X-ray beams and further adapted to convert the X-ray beams to a plurality of electrical signals and at least one integrated circuit array, for example, data acquisition chip array to acquire data corresponding to the electrical signals. The integrated circuit array, for example, data acquisition chip array further comprises a plurality of integrated circuits, such as, data acquisition chips mounted on at least one printed circuit board and a thermal management system adapted for thermal communication between the data acquisition chip array and a heat sink assembly to control thermal environment of each detector assembly. The heat sink further comprises a spreader plate extending over 2 or more data acquisition chips to reduce the temperature difference within the data acquisition chips.

System and method for thermal management of CT detector circuitry

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Niskayuna, NY, United States of America

Sandeep Shrikant Tonapi