Tyco Electronics Corporation

Te Connectivity Corporation

Sandeep Razdan

Jibin Sun

Haipeng Zhang

Terry P Bowen

James J Toth

William Atley Weeks

Nicola Pugliano

An interposer for coupling an optical conduit to an optical component, said interposer comprising: (a) an optical component; (b) a first lens component having a first lens; (c) a second lens component having a second lens, said first and second lenses being configured to define an expanded-beam coupling therebetween; (d) at least one reflective surface optically coupled with said second lens; (e) a first optical path at least partially defined between said optical component and said first lens to accommodate a diverging light beam from said optical component to said first lens; (f) a second optical path at least partially defined between said second lens and said at least one reflective surface to accommodate a converging light beam from said second lens and said at least one reflective surface; and (g) a separable interface along said second optical path or at said expanded-beam coupling.

Interposer with separable interface

One aspect of the invention provides an optoelectronics structure including: a substrate defining a trench on a first surface; and a VCSEL structure mounted vertically within the trench of the substrate such that the VCSEL structure emits a laser beam substantially parallel to the substrate. Another aspect of the invention provides an optoelectronics structure including: an fiber guiding substrate defining a trench on a first surface; a VCSEL structure mounted vertically within the trench of the fiber guiding substrate such that the VCSEL structure emits a laser beam substantially parallel to the substrate; and an optical fiber mounted on the fiber guiding substrate substantially coaxial with the laser beam emitted by the VCSEL structure.

Optoelectronics structures

One aspect of the invention provides a method of fabricating a mode size converter. The method includes: exposing a photoresist-coated substrate to varying doses of light exposure to produce a profile in the photoresist of a beam mode size converter; and etching the photoresist-coated substrate to remove an equal thickness of the photoresist and substrate. The beam mode sized converter includes: a first surface having a first surface height and a first surface width; a second surface opposite the first surface, the second surface having a second surface height different than the first surface height and a second surface width different than the first surface width; and one or more boundary surfaces connecting the first surface and second surfaces.

Mode size converters and methods of fabricating the same

Growing community of inventors

Millbrae, CA, United States of America

Sandeep Razdan