Cisco Technology, Inc.

Intel Corporation

Sandeep Razdan

Matthew Joseph Traverso

Ashley J Maker

Aparna R Prasad

Vipulkumar K Patel

Mark Andrew Webster

Joyce J M Peternel

Robert L Sankman

Jock T Bovington

Sairam Agraharam

Robert M Nickerson

Edward Rudolph Prack

Shan Zhong

Nisha Ananthakrishnan

Ashley J M Erickson

Sivakumar Nagarajan

Seungjae Lee

Rahul N Manepalli

Rajasekaran Swaminathan

Ravi Sekhar Tummidi

Vipul V Mehta

Myung Jin Yim

Rajen S Sidhu

Suriyakala Ramalingam

Wei Tan

Hong Dong

Kabirkumar Mirpuri

Craig Jonathan Weinman

Nisha Ananthakrisnan

An apparatus includes a substrate, a frame, and a socket. The frame defines a slot. The frame is coupled to the substrate such that the slot is aligned with an attachment location on the substrate. The socket receives a first device. The socket aligns with the attachment location on the substrate when the socket is inserted in the slot.

Socket locator

An optoelectronic assembly and methods of fabrication thereof are provided. The assembly includes a mold compound; a photonic integrated circuit (PIC) embedded in the mold compound, that has a face exposed from the mold compound in a first plane; an interposer embedded in the mold compound, that has a face exposed from the mold compound in the first plane (i.e., co-planar with the exposed face of the PIC); and an electrical integrated circuit (EIC) coupled to the exposed face of the PIC and the exposed face of the interposer, that establishes bridging electrical connections between the PIC and the interposer.

Integrated circuit bridge for photonics and electrical chip integration

Embodiments herein describe an optical system that includes a photonic integrated circuit (PIC) bonded to a package containing an electrical integrated circuit (EIC). However, this bond can prevent an edge coupler from optically aligning an optical fiber to an edge of the PIC in order to transfer optical signals. To provide room for the edge coupler, the PIC is arranged to overhang the package containing the EIC so that the package does not interfere with the ability of the edge coupler to align with the side or edge of the PIC. In this manner, an optical fiber can be optically aligned (e.g., butt coupled) to the edge of the PIC rather than having to use a grating coupler or some other less efficient optical coupling in order to transfer optical signals between the PIC and the optical fiber.

Photonics packaging platform

An opto-electronic package is described. The opto-electronic package is manufactured using a fan out wafer level packaging to produce dies/frames which include connection features. Additional structures such as heat exchanged structures are joined to a connection component and affixed to packages, using the connection features, to provide structural support and heat exchange to heat generating components in the package, among other functions.

Thermal packaging with fan out wafer level processing

Aspects described herein include a method comprising bonding a photonic wafer with an electronic wafer to form a wafer assembly, removing a substrate of the wafer assembly to expose a surface of the photonic wafer or of the electronic wafer, forming electrical connections between metal layers of the photonic wafer and metal layers of the electronic wafer, and adding an interposer wafer to the wafer assembly by bonding the interposer wafer with the wafer assembly at the exposed surface. The interposer wafer comprises through-vias that are electrically coupled with the metal layers of one or both of the photonic wafer and the electronic wafer. The method further comprises dicing the wafer assembly to form a plurality of dies. A respective edge coupler of each die is optically exposed at an interface formed by the dicing.

Wafer-scale fabrication of optical apparatus

The present disclosure provides for periscope optical assemblies within interposers that include a bulk material having a first side and a second side opposite to the first side; a first optic defined in the bulk material at a first height in the bulk material along an axis extending between the first second sides; a second optic defined in the bulk material at a second height in the bulk material, different than the first height, along the axis; a first waveguide defined in the bulk material, extending from the first side to the first optic; a second waveguide defined in the bulk material, extending from the second optic to the second side; and a third waveguide defined in the bulk material, extending from the first optic to the second optic.

Periscope optical assembly

An optical connection assembly joining optical components is described. The optical connection assembly is manufactured using a fan out wafer level packaging to produce dies/frames which include mechanical connection features. A fastener is joined to a connection component and affixed to the mechanical connection features, to provide structural support to the connection between the connected component and the die/frame structure.

Connection features for electronic and optical packaging

Photonic devices include a photonic assembly and a substrate coupled to the photonic assembly. The photonic assembly includes a photonic die and an optical device coupled to the photonic die with an adhesive to form an optical connection between the optical device and the photonic die. The photonic assembly is coupled to the photonic assembly by reflowing a plurality of solder connections at temperature that is less than a cure temperature of the adhesive.

Low temperature solder in a photonic device

The present disclosure provides a frame lid assembly, which may be used in assembling an optical platform to provide isolated thermal conduction paths for various elements thereof. The frame lid assembly includes a first frame lid, including: a foot, disposed in a first plane; a roof, disposed in a second plane parallel to the first plane, the roof defining a port as a first through-hole that is perpendicular to the second plane; a wall, disposed obliquely to the first plane, separating the roof from the foot, the wall defining a slot as a second through-hole that is parallel to the first plane; a second frame lid connected to the first frame lid and thermally isolated from the first frame lid, the second frame lid including: a cap, connected to the roof via a thermal insulator; and a plug, extending perpendicularly from the cap through the port.

Frame lid for in-package optics

Using laser patterning for an optical assembly, optical features are written into photonic elements at the end of a manufacturing sequence in order to prevent errors and damages to the optical features. The optical assembly is manufactured by affixing a photonic element to a substrate which includes one or more optical features and mapping one or more optical features for the photonic element. The optical features are then written into the fixed photonic element using laser patterning and the optical assembly is completed by connecting components, such as optical fibers, to the photonic element.

Passive fiber to chip coupling using post-assembly laser patterned waveguides

Optoelectronic device modules having a silicon photonics transmitter die connected to a silicon interposer are described. In an example, the optoelectronic device module includes a silicon photonics transmitter die connected to a silicon interposer, and the silicon interposer is disposed between the silicon photonics transmitter die and a substrate. The silicon interposer provides an electrical interconnect between the silicon photonics transmitter die and the substrate, and reduces a likelihood that a hybrid silicon laser on the silicon photonics transmitter die will be damaged during module operation.

Optoelectronic device module having a silicon interposer

Aspects described herein include a method comprising forming an insulator layer above a silicon layer of a silicon-on-insulator (SOI) substrate. A first optical device is formed partly in the silicon layer and partly in the insulator layer. A first optical waveguide is formed in the insulator layer and optically coupled with the first optical device. The method further comprises forming conductive contacts extending partly through the insulator layer to the first optical device, bonding a first surface of an interposer with a top surface of the insulator layer, and forming, from a second surface of the interposer opposite the first surface, a plurality of first conductive vias extending at least partly through the interposer. The plurality of first conductive vias are coupled with the conductive contacts.

Growing community of inventors

Burlingame, CA, United States of America

Sandeep Razdan