Nihon Micro Coating Co., Ltd.

Sanaki Horimoto

Yuji Horie

Noriyuki Kumasaka

Takuya Nagamine

Takehiro Watanabe

Fumi Murokawa

Masahiro Hosoi

An oxide superconductor member is composed of a tape-shaped substrate, an intermediate layer formed on this substrate and an oxide superconductor thin film layer formed on this intermediate layer. A surface of the tape-shaped substrate is polished by continuously running the tape-shaped substrate. The polishing step includes initial polishing process and finishing process which are carried out such that the average surface roughness Ra of the substrate becomes 2 nanometers or less and the in-plane directionality of the intermediate layer becomes 5&#xb0; or less after the polishing step.

Method for polishing tape-shaped substrate for oxide superconductor, oxide superconductor, and base material for oxide superconductor

A target surface of a tape-shaped substrate of an oxide superconductor with an intermediate layer formed on this target surface and an oxide superconductor thin film is polished by causing the tape-shaped substrate to continuously run. The polishing step includes an initial polishing process for carrying out random polishing of the target surface and a finishing process that is carried out after the initial polishing process for forming grooves on the target surface along the running direction of the substrate. The intermediate layer has an in-plane directionality of 7&#xb0; or less. The tape-shaped substrate is fabricated by rolling nickel, a nickel alloys or stainless steel.

Method of polishing tape-shaped substrate and substrate for oxide superconductor

A polishing system and a method are presented for uniformly polishing efficiently at a fast rate the surface of a tape-like metallic base material of several hundred meters in length. The polishing system is provided not only with devices for causing the base material to travel continuously and applying a specified tension in the base material but also with a first polishing device for randomly polishing the target surface and a second polishing device for carrying out a final polishing on the target surface in the direction of travel of the base material. Polishing marks are formed in the direction of travel on the target surface by the final polishing.

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Akishima, Japan

Sanaki Horimoto