Senju Metal Industry Co., Ltd.

Sanae Taniguchi

Mitsuo Zen

Takenori Azuma

Hideyuki Yoshino

Masaaki Goto

Fumiaki Nishiuchi

Misao Nakajima

A solder coated lid for a package for an electronic device has a lead-free solder layer comprising a Sn&#x2014;Sb based solder with a liquidus temperature of at least 220 degrees C. provided on at least a region of the lid where the lid is to be joined to a base of a package. The lid can be joined to a base of a package at a low temperature, thereby reducing vaporization of solder components and adhesion thereof to electronic devices within the package.

Solder coated lid

A lid for use with a plate-shaped base to seal an electronic device such as a SAW device includes a top portion, a wall structure extending from the top portion, and a lip connected to the lower end of the wall structure. The lip extends outwards from an outer surface of the wall structure by 10&#x2013;500 &#x3bc;m and has solder on an inner surface thereof. The lid can be soldered to a plate-shaped base to form a package. The lid can be conveniently formed by performing drawing of a metal strip coated with solder to define a recessed shape, and then severing a flange of the recessed shape to define the lip.

Lid for use in packaging an electronic device and method of manufacturing the lid

Growing community of inventors

Minamisaitama-gun, Japan

Sanae Taniguchi