Delco Electronics Corporation

Delphi Technologies, Inc.

Samuel Victor Bristol

David Ross Summers

Mary Beth Young

Eugene Horace Hanaway

Thomas R Mueller

Mary Jane Barnaby

Delbert R Walls

A soldering flux containing borneol, which is also referred to as bornyl alcohol. A method soldering using such a flux is also disclosed. Even minor proportions of borneol in the flux help reduce ionic residue from the flux after soldering. Larger proportions of borneol can give the flux tackiness for wave soldering operations. The flux preferably comprises borneol and an organic acid activator that volatilizes during soldering. The flux is applied as a solution of borneol and the organic acid activator in a solvent that substantially evaporates before soldering without leaving any measurable solvent residue.

Flux solution for soldering containing borneol

Soldering method using a flux containing borneol

A coating composition for use in protecting metal, and for use as a soldering flux, and methods involving the same. A coating for circuit boards and processes involving the same. One coating material can serve as a metal corrosion inhibitor, a no-clean soldering flux, and/or a protective coating in replacement of a conformal coating. In its most preferred form, this invention serves all three functions in the manufacture of an electrical circuit board.

Coatings and methods, especially for circuit boards

Multifunctional soldering flux with borneol

Low residue water-based soldering flux, and process and system for using the same. The flux includes a mixture of succinic, glutaric and adipic acid in water, and optionally a wetting agent. The flux is applied to a surface to be soldered. The flux is dried. The surface is soldered. The flux is applied at an application station, dried at a drying station and soldered at a soldering station.

Low residue water-based soldering flux and process for soldering with

A low residue soldering flux contains a non-subliming dibasic acid mixture of by weight about 15-30% succinic acid, 40-63% glutaric acid and 10-30% adipic acid, e.g., in a volatilizable organic solvent, formed as a rosin-containing or rosin-free flux. The dibasic acid mixture is capable of volatilizing during heat soldering to leave a soldered product (e.g., an electronic circuit board) essentially free from corrosion-promoting ionic residue. This eliminates the need for a residue-removing washing step.

Growing community of inventors

Kokomo, IN, United States of America

Samuel Victor Bristol