Cree Gmbh

Creeled, Inc.

Samuel Richard Harrell, Jr

Jesse Colin Reiherzer

Colin Kelly Blakely

Erin R F Welch

Roshan Murthy

David Suich

Daniel E Stasiw

Submount structures for light-emitting diode (LED) packages are provided. Submounts may include a base material that is configured to provide high thermal conductivity and a ceramic layer on the base material that is configured to provide high reflectivity for one or more LED chips that are mounted thereon. In certain aspects, the base material may include a ceramic base having a ceramic material that is different than a material of the ceramic layer. In certain aspects, submounts may also include additional ceramic layers configured to provide high reflectivity. In certain aspects, LED packages include electrical traces that are arranged either on one or more ceramic layers or at least partially embedded within one or more ceramic layers. The arrangement of such ceramic layers may provide increased reflectivity in areas where it may be difficult for other reflective materials to be present, such as gaps formed between tightly spaced electrical traces.

Submount structures for light emitting diode packages

Light emitting device

Growing community of inventors

Cary, NC, United States of America

Samuel Richard Harrell, Jr