Corning Incorporated

Samuel Odei Owusu

Benedict Yorke Johnson

Tammy Lynn Petriwsky

Robert Carl Burket

Uta-Barbara Goers

Described herein are methods of making metallic or elemental silver in the solid state. These methods generally include a step of forming an at least substantially solvent-free solid state reaction mixture that includes a silver-containing compound and an organic acid, followed by heating the reaction mixture at a temperature and for a time effective to form metallic silver from a cationic silver species of the silver-containing compound. Also described herein are metallic or elemental silver produced by these methods.

Solvent-free syntheses of silver products produced thereby

A method etching a glass material comprises providing an etchant comprising 10-30% HF, 5-15% HNO,and at least 10% HPOby volume constituted such that the ratio HF:HNOby volume is in the range of 1.7:1 to 2.3:1, providing a glass material to be etched, and contacting the glass material with the etchant. The etchant desirably has no other acid components. The method may be performed with the etchant temperature within the range of 20-30&#xb0; C. The glass material may be an aluminosilicate glass. Ultrasound energy may be applied to the etchant, to the glass material, or both.

Etch rate enhancement at low temperatures

Described herein are methods of making metallic or elemental silver. These methods generally include a step of forming a reaction dispersion that includes a silver-containing compound, an organic acid, and a solvent that includes an alcohol, followed by mixing the reaction dispersion for a time and at a temperature effective to form a reaction product that includes metallic silver from a cationic silver species of the silver-containing compound. Also described herein are metallic or elemental silver produced by these methods.

Low-temperature dispersion-based syntheses of silver and silver products produced thereby

Methods for forming vias in glass substrates by laser drilling and acid etching are disclosed. In one embodiment, a method forming a via in a glass substrate includes laser drilling the via through at least a portion of a thickness of the glass substrate from an incident surface of the glass substrate. The method further includes etching the glass substrate for an etching duration to increase a diameter of an incident opening of the via and applying ultrasonic energy to the glass substrate during at least a portion of the etching duration. The applied ultrasonic energy has a frequency between 40 kHz and 192 kHz.

Methods for forming vias in glass substrates

Described herein are methods of recovering silver from solution to produce metallic (i.e., elemental) silver. These methods generally include a step of providing a silver-containing aqueous solution that includes cationic silver species, followed by a step of forming a reaction solution that includes an organic acid, a buffering agent, and the cationic silver species, and a step of generating a reaction product that includes metallic silver by reducing the concentration of the cationic silver species in the reaction solution. Also described herein are metallic or elemental silver produced by these methods.

Growing community of inventors

Horseheads, NY, United States of America

Samuel Odei Owusu