Ii-vi Delaware, Inc.

Samuel M Salamone

Glen Evans

A composite material can include: a substrate of a first reaction-bonded silicon carbide (first RB-SiC) material; and a reaction-bonded diamond-retaining silicon carbide (RB-DSiC) layer bonded to a surface of the substrate. In some aspects, the RB-DSiC layer includes diamond particles bonded with a second reaction-bonded silicon carbide (second RB-SiC) material. The diamond particles may be homogeneously distributed through the second RB-SiC or only at the surface thereof. The diamond particles can be in an ordered pattern or un-ordered pattern. For example, a CMP conditioning disc can include the composite material of one of the embodiments.

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Philadelphia, PA, United States of America

Samuel M Salamone