General Electric Company

Rca Inc.

Samuel L Williams

Norman R Landry

Robert L Schelhorn

A thick film, multi-layer interconnected circuit board includes a substrate of an electrical insulating material which will withstand high temperatures, such as alumina, having over a surface thereof a plurality of stacked layers of a glass dielectric. Between each pair of dielectric layers is a thick film conductor layer. The dielectric layers have openings or vias therethrough which are filled with a conductive material which makes electrical contact with the adjacent conductive layers. A contact pad is over the topmost dielectric layer and is electrically connected to a via conductor material in the topmost dielectric layer. The contact pad is of a thick film conductive material which is a layer of glass having particles of a conductive material, such as a noble metal or mixture of noble metals, dispersed therein. A bonding layer is between the contact pad and the topmost dielectric layer and is bonded to both. The bonding layer is of a mixture of the glass of the dielectric layers and the thick film conductive material of the contact pad.

Thick film, multi-layer, ceramic interconnected circuit board

A thick film resistor element capable of dissipating relatively large amounts of microwave energy comprises several distinct layers of resistive material overlying an electrically insulating thermally conducting substrate. The final dimensions of the element can be made comparatively small with respect to a conventional element having comparable dissipation capability. The element has a coating of a crossover dielectric material which provides a moisture barrier between the element and the ambient.

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Glassboro, NJ, United States of America

Samuel L Williams