Kaneka Americas Holding, Inc.

Samuel Kyran

Hiroyuki Furutani

Methods may include coating a substrate with a polyimide precursor composition prepared from a reaction of a diamine component and a dianhydride component, wherein the reaction includes: a diamine component containing one or more diamines having the formula: wherein R3 is selected from hydrogen, methyl, and halogen; a dianhydride component containing one or more dianhydrides, wherein the one or more dianhydrides include 4,4'-bisphenol A dianhydride (BPADA); and at least one comonomer selected from: one or more additional diamine comonomers, wherein the one or more additional diamine comonomers are present at 1 to 40 mol % of the diamine component; and/or one or more additional dianhydride comonomers, wherein the one or more additional dianhydride comonomers are present at 1 to 40 mol % of the dianhydride component; and curing the polyimide precursor composition to generate a polyimide adhesive on the substrate.

Polyimides for temporary bonding adhesives, methods for manufacturing of thermoplastic polyimide materials, and methods for thin wafer bonding using the same

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Pasadena, TX, United States of America

Samuel Kyran