3m Innovative Properties Company

Samuel Kidane

Mark A Roehrig

Mark D Weigel

Alan K Nachtigal

Andrew J Henderson

Michael D Delmore

Karl K Stensvad

Tracie J Berniard

Daniel H Carlson

James N Dobbs

Paul A Martinson

Daniel J Theis

Brian Kenneth Nelson

Ronald P Swanson

Thomas Herdtle

Stanley Rendon

Grant F Tiefenbruck

An assembly that includes a barrier film interposed between a first polymeric film substrate and a first major surface of a pressure sensitive adhesive layer is provided. The first polymeric film substrate has a first coefficient of thermal expansion that is, in some embodiments, up to 50 parts per million per Kelvin. The pressure sensitive adhesive layer has a second major surface opposite the first major surface that is disposed on a second polymeric film substrate. The second polymeric film substrate is typically resistant to degradation by ultraviolet light. In some embodiments, the second polymeric film substrate has a second coefficient of thermal expansion that is at least 40 parts per million per Kelvin higher than the first coefficient of thermal expansion. The assembly is transmissive to visible and infrared light.

Barrier assembly

Barrier assembly with encapsulant and photovoltaic cell

The present application is directed to an assembly comprising an electronic device, and a multilayer film. The multilayer film comprises a barrier stack adjacent the electronic device; and a weatherable sheet adjacent the barrier stack opposite the electronic device. The assembly additionally comprises a protective layer in contact with the electronic device and the weatherable sheet. The present application allows for the combination of any of the disclosed elements.

Edge protected barrier assemblies

A method of applying a conductive pattern of metal onto a web of indefinite length material. This method includes applying a metal containing composition onto the web in a predefined pattern, providing a roll having a very low thermal mass, and conveying the patterned web around the roll while simultaneously applying heat energy to the metal containing composition thereby converting the metal to a conductive pattern. This allows for flexible circuitry to be fabricated in an inexpensive roll-to-roll process.

Method for continuous sintering on indefinite length webs

A heatsink for use in injection molding, with at least one load-bearing path with a rearward segment, wherein at least a portion of at least one non-load-bearing, dynamic heat-transfer zone of the heatsink is laterally offset from the rearward segment of the load-bearing path.

Injection molding apparatus and method

Growing community of inventors

Saint Paul, MN, United States of America

Samuel Kidane