Rohm and Haas Electronic Materials Cmp Holdings, Inc.

Rohm and Haas Company

Samuel J November

Alan Saikin

Andrew M Geiger

Paul J Sacchetti

Malcolm W Robertson

John Esbenshade

Paul Libbers

Jonathan Tracy

Kari-Ell Norton

David Verbaro

Michael E Watkins

Joseph P Koetas

Alan E Leviton

Arthur A Chin

Stephen Gerard Maroldo

Francis Lipiecki

John Hiroshi Yamamoto

Puja Jain

Suzanne Linehan

Arthur Achhing Chin

Francis Joseph Lipiecki

A process for production of a borohydride compound. The process comprises combining a compound comprising boron and oxygen with an adduct of alane.

Process for production of a borohydride compound

A mix head assembly for use in the manufacture of chemical mechanical polishing pad polishing layers is provided, wherein inclusions of entrained gas inclusion defects are minimized.

Mix head assembly for forming chemical mechanical polishing pads

A method for manufacturing chemical mechanical polishing pad polishing layers that minimizes entrained gas inclusion defects is provided. Also provided is a mix head assembly for use in the manufacture of chemical mechanical polishing pad polishing layers, wherein inclusions of entrained gas inclusion defects are minimized.

Method for manufacturing chemical mechanical polishing pad polishing layers having reduced gas inclusion defects

The present invention provides a method of forming a chemical mechanical polishing pad, comprising providing a tank with polymeric materials and providing a storage hopper with microspheres having an initial bulk density, wherein the storage hopper further comprises a porous membrane provided over a plenum. The method further provides the steps of connecting a fluidizing gas source to the plenum through a gas inlet line and fluidizing the microspheres and reducing the initial bulk density by feeding gas into the plenum. In addition, the method further provides the steps of providing a delivery system for delivering the polymeric materials and the microspheres to a mixer, forming a mixture of the polymeric materials and the microspheres, pouring the mixture into a mold to form a molded product and cutting the molded product into the polishing pad.

Method of forming a polishing pad having reduced striations

The present invention provides an apparatusfor forming a striation-reduced chemical mechanical polishing pad. The polishing padcomprises a first delivery linefor delivering a polymeric materialinto a mixerand a second delivery linefor delivering microspheresinto the mixerwith the polymeric material. The second delivery lineis connected to a bulk density control unit. The bulk density control unitcomprises a storage hopperfor storing the microspheres. The storage hopperfurther comprises a porous membraneprovided over a plenum. A fluidizing gas sourceis connected to the plenumthrough a gas inlet line. Gasfed into the plenumfrom the fluidizing gas sourcepermeates through the porous membraneand reduces the initial bulk density of the microspheresin the storage hopper

Apparatus for forming a polishing pad having a reduced striations

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Newtown, PA, United States of America

Samuel J November