Rogers Corporation

Samuel Gazit

Richard T Traskos

Thomas S Kneeland

William P Harper

Carlos L Barton

Jane L Cercena

Michael J Taylor

Jeffrey B Otto

John A Olenick

Cathy A Fleischer

Brett W Kilhenny

Lynn E Burdick

W David Smith

Scott E Derosier

Curtis H Kempton

Robert B Huntington

James S Rivers

Jeffrey B Ott

Gary W Adams

Kathleen R Olenick

Leonard S Calabrese

Daniel J Navarro

Mark F Sylvester

Angela M Kneeland

In accordance with the present invention, an MCM substrate product is manufactured in an additive process using multiple layers of a fluoropolymer composite material and copper. The copper layers are plated, and the fluoropolymer composite layers are laminated. A seeding process promotes reliable bonding between the fluoropolymer composite material and the plated copper. The use of the filled fluoropolymeric composite eliminates the need for a barrier metal layer between the insulation and the conductors. The MCM substrate device of the present invention may have multiple metal layers and multiple dielectric layers; four or five, or more, of each in a single structure would be easily achieved and is typical. The structure would include lead lines in separate mutually orthogonal planes (sometimes referred to as 'x' and 'y' lead lines) sandwiched between ground and power voltage planes of copper. The MCM substrate device of the present invention also has solid copper vias, which may be used either as electrical interconnection between layers of the MCM substrate and/or to the I/C's to be packaged in the module, or as thermal vias for heat conduction for thermal management. The manufacturing process of the present invention makes it possible to start or stop any via in any layer of the device.

Method of manufacture multichip module substrate

A flexible circuit is presented having a flexing (cyclic bending) section of lower stiffness than adjacent parts of the circuit. The lower stiffness in the flexing section is achieved by reducing the thickness of the flexing section, either by omitting or removing some or all of the dielectric material of the flexible circuit in the flexing section, or by replacing conventional dielectric material in the flexing section with a polymer of lower modulus of elasticity.

Flexible circuit having flexing section of reduced stiffness, and method

A printed circuit board composed of an epoxy impregnated nonwoven web substrate laminated to electrically conductive sheets is presented. The printed circuit board is flexible in the sense that it can be bent to any desired multiplanar shape and will retain that shape after installation as required by electronic interconnection systems. The printed circuit board also has improved thermal properties achieved through the addition of up to 70% by weight of low coefficient of thermal expansion (CTE) particulate fillers and/or the use of thermally stable reinforcement fibers in the non-woven web.

Shape retaining flexible electrical circuit

A flexible circuit laminate is presented comprising a microglass reinforce fluoropolymer layer sandwiched between a fluoropolymer coated polyimide and a copper conductive pattern. The glass reinforced fluoropolymer acts as a high bond strength adhesive between the fluoropolymer coated polyimide and copper conductive pattern. The glass reinforced fluoropolymer also contributes to improved dimensional stability as well as improved electrical performance. Preferably, the microglass content is between about 4 to about 30 weight percent, and more preferably about 20 weight percent glass.

Flexible circuit laminate

A flexible circuit laminate is presented comprising a microglass reinforced fluoropolymer layer sandwiched between a polyimide substrate and a copper conductive pattern. The glass reinforced fluoropolymer acts as a high bond strength adhesive between the polyimide and copper conductive pattern. The glass reinforced fluoropolymer also contributes to improved dimensional stability as well as improved electrical performance. Preferably, the microglass content is between about 4 to about 30 weight percent, and more preferably about 20 weight percent glass. In a method of making the flexible circuit laminate, the polyimide substrate undergoes a preferably alkaline microetching surface treatment, followed by rinsing, drying and lamination to the microglass reinforced fluoropolymer and copper layers.

Flexible circuit laminate and method of making the same

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West Hartford, CT, United States of America

Samuel Gazit