Hyundai Electronics America, Inc.

Ncr Corporation

Other

Lsi Logic Corporation

At&t Global Information Solutions Company

Samuel C Gioia

Gayle W Miller

Kenneth P Fuchs

Derryl D J Allman

Todd A Randazzo

Derryl D Allman

John D Walker

A low dielectric material is applied, as by spinning on, over the passivation layer of a semiconductor chip to fill the gaps which may exist between the top layer metal lines, and thereby minimize the possibility of cross talk which might otherwise be present between those lines.

Integrated circuit device comprising low dielectric constant material for reduced cross talk

Low dielectric constant material in integrated circuit

Integrated circuit device with reduced cross talk

Method for using low dielectric constant material in integrated circuit fabrication

MOS functional devices and electrostatic discharge protection devices are formed on a substrate having a relatively low-resistance area beneath the functional devices to inhibit latch-up of the functional devices and a relatively high resistance area beneath each electrostatic protection device to reduce the snapback holding voltage of each electrostatic discharge protection device.

NMOS electrostatic discharge protection device and method for CMOS

A field effect transistor with improved electrostatic discharge (ESD) protection has a source, a channel underlying a gate electrode and a drain. The drain includes a lightly doped ballast resistor extending across the width of the drain and separating two other drain sub-regions. One drain sub-region is located between the ballast resistor and the channel, the other drain sub-region is opposite the resistor and connected to an exterior device. The ballast resistor laterally distributes current along the width of the drain during an ESD pulse, which reduces local peak current density and reduces damage.

Lightly doped drain ballast resistor

Method for using low dielectric constant material in integrated circuit

A process for forming an asymmetrically structured pair of CMOS field effect transistors having feature refinements matched to the individual idiosyncrasies of the p-channel and n-channel transistors. Complementary transistors are formed using a single photolithographic mask and a fabrication sequence which begins with the p-channel transistor source/drain formation. Thereafter, the p-channel transistor source/drain regions are metalized, the n-channel transistor lightly doped drain regions are formed, and the sidewall dielectric spaced n-channel transistor source/drain regions are formed using the p-channel metalization as a mask. The p-channel transistor source/drain metalization suppresses the effects of the relatively greater p-type source/drain resistivity, while the LDD structure of the n-channel transistor reduces performance degradation attributable to hot electron trapping. The structural asymmetry attributable to the process materially offsets performance limitations common to the individual CMOS transistor types.

Method of making asymmetrically optimized CMOS field effect transistors

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Colorado Springs, CO, United States of America

Samuel C Gioia