Raytech Composites, Inc.

Samuel A Truncone

Laurie Bowles

Angela L Petroski

Wayne D Woodson

Hualin Jiang

James J Petroski

Wenping Zhao

James Macey

A process and apparatus for making die-dried friction wafers collects friction particulates in a mold defining a wafer. The mold includes at least one perforate wall portion against which an aqueous slurry including the particulates is passed to form at least one layer on the wall as the particulates collect in the mold. The collection is dried followed by curing, and may be cured in the mold by heating.

Process for molding a friction wafer

A wet friction material is disclosed bonded to a plate for transmission of motion, with the friction material made up of a porous fiber substrate, which is at least partially impregnated with a catalyzed resorcinol diglycidyl ether resin to improve properties.

Porous wet friction material utilizing a compliant epoxide resin binder system

A friction disk suitable for running as an assembly of interleaved disks in a transmission is disclosed. A rigid metallic core on backing plate is covered on one or both sides with a wafer of non-woven yarn wherein the yarn comprises a continuous wound length of heat resistant yarn in a non-overlapping fashion. The yarn is bonded to the core by a thermosetting resin, which is impregnated into the yarn by less than 80% by weight to preserve porosity and allowing penetration of the cooling transmission fluid. The yarn preferably is composed of carbon fibers or filaments.

Continuous yarn laid wet friction material

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Crawfordsville, IN, United States of America

Samuel A Truncone