Avery Dennison Corporation

Samuel A Linder

Jason D Munn

Steven C Kennedy

Ian J Forster

David Puleston

David Nicholas Edwards

Thomas Craig Weakley

Scott Wayne Ferguson

Peikang Liu

Christine U Dang

John F Hughen

Edward A Armijo

A radio frequency identification (RIFD) inlay includes an electrical connection between a chip and an antenna. The electrical connection includes conductive interposer leads and a capacitive connection. The capacitive connection may involve putting the antenna and the interposer leads into close proximity, with dielectric pads therebetween, to allow capacitive coupling between the antenna and the interposer leads. The dielectric pads may include a non-conductive adhesive and a high dielectric material, such as a titanium oxide. The connections provide a convenient, fast, and effective way to operatively couple antennas and interposers. The RFID inlay may be part of an RFID label or RFID tag.

RFID device and method of forming

A method of making RFID devices includes feeding in an interposer web or sheet at a variable (non-constant) speed, cutting single interposers from the interposer web or sheet, and using a rotary transport device to transport the singulated (cut) interposers to an antenna web. The interposers are transferred from the rotary transport device and are attached to the antenna web, being operatively coupled to antennas on the antenna web. The interposers each include an RFID transponder chip and conductive leads. A feeder is used to advance the interposer web or sheet into a cutting zone between the rotary cutter and the rotary transport device. The rotary cutting device may be capable of singulating multiple interposers at one time, and the system may be capable of thus being able to remove interposers that are not to be joined to the antenna web.

Method of manufacturing RFID devices

A radio frequency identification (RFID) inlay includes an electrical connection between a chip and an antenna. The electrical connection includes conductive interposer leads and a capacitive connection. The capacitive connection may involve putting the antenna and the interposer leads into close proximity, with dielectric pads therebetween, to allow capacitive coupling between the antenna and the interposer leads. The dielectric pads may include a non-conductive adhesive and a high dielectric material, such as a titanium oxide. The connections provide a convenient, fast, and effective way to operatively couple antennas and interposers. The RFID inlay may be part of an RFID lable or RFID tag.

Growing community of inventors

Moore, SC, United States of America

Samuel A Linder