Heraeus Precious Metals North America Conshohocken LLC

Heraeus Deutschland Gmbh & Co Kg

Heracus Precious Metals North America Conshohocken LLC

Samson Shahbazi

Mark Challingsworth

Steven Grabey

Ryan Persons

Wolfgang Schmitt

Seigi Suh

Matthew Sgriccia

Ly May Chew

Steve Grabey

A silver sintering preparation comprising:

Silver sintering preparation and the use thereof for the connecting of electronic components

A dielectric glass composition suitable for use in an electronic device which comprises a sufficient amount of silicon dioxide to impart durability to the glass composition when subject to a humid environment, and one or more alkali metal oxides, wherein (i) the total content of the alkali metal oxides is at least about 10 wt % and no more than about 35 wt %, based upon 100% total weight of the glass composition, (ii) the median particle size (d) of the glass composition is no more than about 5 &#x3bc;m, and (iii) the glass composition has a coefficient of thermal expansion of at least about 10 ppm/K and no more than about 25 ppm/K, is provided.

Dielectric glass composition

A dielectric tape suitable for use in an electronic device is provided. A dielectric slip composition comprises an organic vehicle and a dielectric glass composition comprising at least about 20 wt % and no more than about 50 wt % silicon dioxide, based upon 100% total weight of the glass composition, at least about 10 wt % and no more than about 50 wt % alkali metal oxides, based upon 100% total weight of the glass composition, and at least about 1 wt % and no more than about 10 wt % of at least one transition metal oxide. A method of forming an electronic device is also provided. The method includes the steps of applying at least one dielectric tape to at least one non-planar surface of a substrate, and subjecting the at least one dielectric tape to one or more thermal treatment steps to form a dielectric layer.

Dielectric tape compositions

A conductive polymer thick film composition suitable for lead-free soldering comprising metallic particles and an organic vehicle comprising at least one phenolic resin and a solvent is provided. A method of soldering to the conductive polymer thick film composition of the invention is also provided. An article comprising a substrate and a cured polymer film on a surface of the substrate formed of the conductive polymer thick film composition of the invention is provided.

Solderable conductive polymer thick film composition

An electroconductive hole plug paste comprising about 60-80 wt % of platinum particles, about 10-20 wt % of AlO, and about 10-20 wt % of organic vehicle, based upon 100% total weight of the paste, wherein the organic vehicle includes at least one viscosity-modifying component in an amount sufficient to provide the electroconductive hole plug paste with a viscosity of about 800-1,500 kcPs, is provided. A ceramic substrate assembly for an implantable medical device having the electroconductive hole plug paste of the invention, and a method of forming the same, are also provided.

Platinum containing conductive paste

An electroconductive paste comprising first copper particles having a specific surface area of about 0.15-1.0 m/g, second copper particles having a specific surface area of about 0.5-2.5 m/g, glass frit and an organic vehicle. According to another embodiment of the invention, the first copper particles are about 60-80 wt. % of the paste, while the content of the second copper particles is up to about 20 wt. % of the paste. According to another embodiment, the glass frit is lead-free and is about 1-10 wt. % of the paste. Preferably, the glass frit comprises a boron-zinc-barium oxide glass frit. According to another embodiment, the paste further comprises copper oxide. Another embodiment of the invention relates to an electroconductive paste comprising about 60-95 wt. % copper component, a boron-zinc-barium oxide glass frit, and an organic vehicle.

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Roslyn, PA, United States of America

Samson Shahbazi