Micron Technology Incorporated

Sampath K Ratnam

Kishore Kumar Muchherla

Peter Sean Feeley

Ashutosh Malshe

Vamsi Pavan Rayaprolu

Harish Reddy Singidi

Sivagnanam Parthasarathy

Michael G Miller

Mustafa Nazmi Kaynak

Shane G Nowell

Renato C Padilla

Gary F Besinga

Christopher S Hale

Gianni Stephen Alsasua

Renato Padilla, Jr

Jiangang Wu

Kevin Roy Brandt

Karl David Schuh

Xiangang Luo

Preston Allen Thomson

Yun Li

Daniel J Hubbard

Jung Sheng Hoei

Qisong Lin

Devin M Batutis

Christopher M Smitchger

Tawalin Opastrakoon

Patrick Robert Khayat

Kulachet Tanpairoj

Marc S Hamilton

Violante Moschiano

Jianmin Huang

Ting Luo

Satish K Yanamanamanda

Scott Anthony Stoller

Larry Joseph Koudele

Walter Di-Francesco

Michael Sheperek

Jie Zhou

Cory M Steinmetz

Zixiang Loh

Troy A Manning

Akira Goda

Mark Alan Helm

James Fitzpatrick

Shuhui Chen

Troy D Larsen

Giuseppina Puzzilli

Todd A Marquart

Xu Zhang

Dung Viet Nguyen

Doyle W Rivers

Saeed Sharifi Tehrani

Martin L Culley

Roland J Awusie

Nagendra Prasad Ganesh Rao

Sead Zildzic

Yifen Liu

Pushpa Seetamraju

Hong Lu

Guang Chang Ye

Shao Chun Shi

Abolfazl Rashwand

Sean Stephen Eilert

Jun Wan

Deping He

William C Filipiak

HyungSeok Kim

John Zhang

Shantilal Doru

Michael G McNeeley

Thomas Herbert Lentz

Larry K Koudele

Asheesh Kwatra

An amount of voltage shift is determined for one or more memory cells of a block family based on an initial reference value pertaining to the one or more memory cells and a subsequent reference value pertaining to the one or more memory cells. The block family is associated with a first voltage bin or a second voltage bin based on the determined amount of voltage shift. The first voltage bin is associated with a first voltage offset and the second voltage bin is associated with a second voltage offset.

Voltage bin calibration based on a voltage distribution reference voltage

A first host data item and a second host data item are received. The first host data item is stored in a first page of a first logical unit of a memory device, where the first page is one of a plurality of pages associated with redundancy metadata. A second page a second page of a second logical unit of the memory device is identified, where the second page is one of the plurality of pages associated with the redundancy metadata, and the first page and the second page are associated with different wordlines of the memory device. The second host data item is stored in the second page of the second logical unit of the memory device. The first page and the second page can be associated with a fault tolerant stripe that includes the redundancy metadata.

Diagonal page mapping in memory systems

Systems and methods are disclosed including a memory device and a processing device operatively coupled to the memory device. The processing device can perform operations comprising performing a data integrity check on a source set of memory cells, configured to store a first number of bits per memory cell, to obtain a data integrity metric value; responsive to determining that the data integrity metric value satisfies the threshold criterion, performing an error handling operation on the data stored on the source set of memory cells to generate corrected data; and causing the memory device to copy data the corrected data to a destination set of memory cells of the memory device, wherein the destination set of memory cells are configured to store a second number of bits per memory cell, wherein the second number of bits per memory cells is greater than the first number of bits per memory cell.

Memory compaction management in memory devices

In some implementations, a controller of a memory device may obtain a first metric associated with a memory of the memory device using a first memory read configuration. The controller may apply a function to the first metric to obtain a second memory read configuration. The controller may obtain a second metric associated with the memory using the second memory read configuration. The controller may filter the first metric and the second metric to obtain a first filtered metric and a second filtered metric. The controller may provide the first filtered metric and the second filtered metric to a memory management process executing on the controller. The controller may perform an action based on an output of the memory management process, wherein the output is based on the first filtered metric and the second filtered metric.

Filtering metrics associated with memory

Systems and methods are disclosed including a memory device and a processing device operatively coupled to the memory device. The processing device can perform operations including detecting a read error with respect to data residing in a first block of the memory device, wherein the first block is associated with a voltage offset bin; determining a most recently performed error-handling operation performed on a second block associated with the voltage offset bin; and performing the error-handling to recover the data.

Managing error-handling flows in memory devices

A memory system includes a memory array having a plurality of memory cells; and a controller coupled to the memory array, the controller configured to: designate a storage mode for a target set of memory cells based on valid data in a source block, wherein the target set of memory cells are configured with a capacity to store up to a maximum number of bits per cell, and the storage mode is for dynamically configuring the target set of memory cells in as cache memory that stores a number of bits less per cell than the corresponding maximum capacity.

Memory device with dynamic cache management

An example method of performing read operation comprises: receiving a read request with respect to a set of memory cells of a memory device; determining a value of a media endurance metric of the set of memory cells; determining a programing temperature associated with the set of memory cells; determining a current operating temperature of the memory device; determining a voltage adjustment value based on the value of the media endurance metric, the programming temperature, and the current operating temperature; adjusting, by the voltage adjustment value, a bitline voltage applied to a bitline associated with the set of memory cells; and performing, using the adjusted bitline voltage, a read operation with respect to the set of memory cells.

Cross-temperature compensation based on media endurance in memory devices

Memory devices are disclosed. A memory device may include dynamic cache, static cache, and a memory controller. The memory controller may be configured to disable the static cache responsive to a number of program/erase (PE) cycles consumed by the static cache being greater than an endurance of the static cache. The memory controller may also be configured to disable the dynamic cache responsive to a number of PE cycles consumed by the dynamic cache being greater than an endurance of the dynamic cache. Associated methods and systems are also disclosed.

Memory devices and systems including static and dynamic caches, and related methods

A method includes initiating a voltage calibration scan with respect to a block of a memory device, wherein the block is assigned to a first bin associated with a first set of read voltage offsets, and wherein the first bin is designated as a current bin, measuring a value of a data state metric for the block based on a second set of read voltage offsets associated with a second bin having an index value higher than the first bin, determining whether the value is less than a current value of the data state metric measured based on the first set of read voltage offsets, and in response to determining that the value is less than the current value, designating the second bin as the current bin.

Voltage calibration scans to reduce memory device overhead

A request to access data programmed to a memory sub-system is received. A determination is made of whether memory cells of the memory sub-system that store the programmed data satisfy one or more cell degradation criteria. In response to a determination that the memory cells satisfy the one or more cell degradation criteria, an error correction operation to access the data is performed in accordance with the request.

Accessing data using error correction operation(s) to reduce latency at a memory sub-system

A configuration setting manager of a memory device receives a request to perform an adjustment operation on a set of configuration setting values for the memory device, where each configuration setting value of the set of configuration setting values is stored in a corresponding configuration register of a set of configuration registers; determines a configuration adjustment definition associated with one or more configuration setting values of the set of configuration setting values; calculates an updated set of configuration setting values by applying a multiplier value to the configuration adjustment definition, wherein the multiplier value is associated with a number of programming operations performed on the memory device; and stores the updated set of configuration setting values in the corresponding configuration registers.

Accelerating configuration updates for memory devices

A current value for a reference voltage for a block family is determined. An amount of voltage shift for a memory page of the block family is determined based on the current value for the reference voltage and a prior value for the reference voltage. The block family is associated with a first voltage bin or a second voltage bin based on the determined amount of voltage shift. The first voltage bin is associated with a first voltage offset and the second voltage bin is associated with a second voltage offset.

A request to perform a secure erase operation for a memory component can be received. A voltage level of a pass voltage that is applied to unselected wordlines of the memory component during a read operation can be determined. A voltage pulse can be applied during a program operation to at least one wordline of the memory component to perform the secure erase operation. The voltage pulse can exceed the pass voltage applied to the unselected wordlines of the memory component during the read operation.

Performing a program operation based on a high voltage pulse to securely erase data

Systems and methods are disclosed including a memory device and a processing device operatively coupled to the memory device. The processing device can perform operations comprising selecting a source set of memory cells of the memory device, wherein the source set of memory cells are configured to store a first number of bits per memory cell; performing a data integrity check on the source set of memory cells to obtain a data integrity metric value; determining whether the data integrity metric value satisfies a threshold criterion; and responsive to determining that the data integrity metric value fails to satisfy the threshold criterion, causing the memory device to copy data from the source set of memory cells to a destination set of memory cells of the memory device, wherein the destination set of memory cells are configured to store a second number of bits per memory cell.

A processing device of a memory sub-system is configured to sort a plurality of blocks of the memory device; identify, based on scanning of a first block at a first location of the plurality of sorted block, a first voltage bin associated with the first block; identify, based on scanning of a second block at a second location of the plurality of sorted blocks, a second voltage bin associated with the second block; and responsive to determining that the first voltage bin matches the second voltage bin, assign the first voltage bin to each block that is located between the first location of the plurality of sorted blocks and the second location of the plurality of sorted blocks.

Managing voltage bin selection for blocks of a memory device

Growing community of inventors

Boise, ID, United States of America

Sampath K Ratnam