Semiconductor Components Industries, LLC

Samir Mouhoubi

Peter Moens

Abhishek Banerjee

Filip Bauwens

Jaume Roig Guitart

Joris Baele

Arno Stockman

An electronic device can include a HEMT that includes a channel layer, a barrier layer, and a gate electrode. The barrier layer can be disposed between the channel layer and the gate electrode and include a first portion, a second portion, and a third portion. The second portion can be spaced apart from the channel layer by the first portion, and the second portion is spaced apart from the gate electrode by the third portion. The second portion of the barrier layer can be configured to trap more charge, more readily recombine electrons and holes, or both as compared to each of the first and third portions of the barrier layer. The HEMT can have a Vof at least 2 V and a subthreshold slope of at most 50 mV/decade of I.

Electronic device including a high electron mobility transistor that includes a barrier layer having different portions

A semiconductor device includes a semiconductor substrate defining a major surface. The device further includes a first region including at least a first pillar of a first conductivity type extending in a vertical orientation with respect to the major surface. The device further includes a second region of the first conductivity type. The first pillar includes a higher doping concentration than the second region. The device further includes a Schottky contact coupled to the second region.

Field-effect transistor with integrated Schottky contact

A semiconductor device includes a charge-compensating region with a first structure disposed adjoining an end portion of the charge-compensating region. The first structure is configured to reduce charge-imbalances present in the charge-compensating region. In one embodiment, the first structure includes a trench that extends along the vertical depth of the charge-compensated trench so that the final charge-compensating region is provided without corner portions. In one embodiment, a material, such as a dielectric material and/or a polycrystalline semiconductor material, may be disposed within the trench and at least along the end portion of the charge-compensating region. Among other things, the first structure improves device electrical performance and manufacturing yields.

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Oudenaarde, Belgium

Samir Mouhoubi